These assembly techniques are useful, but they also rely on expensive and specialized positioning tools and well-trained personnel, and can be limited by material properties and throughput.Optical assembly is an alternative strategy to assemble functional structures from micro-and nano-objects as building blocks. [9] Optical assembly relies on optical micromanipulation technologies such as optical tweezers, [9][10][11][12][13] opto-thermophoretic tweezers, [14][15][16] photovoltaic tweezers, [17][18][19][20] and optoelectronic tweezers, [21][22][23][24][25][26][27][28][29][30] in which micro-and nano-objects are optically assembled into a pattern in a fluidic environment and later dried for use in various applications. This approach has advanced rapidly in recent years, and preserves many of the advantages of the conventional methods while being easy-to-implement and allowing for cost-effective operation. Among different optical micromanipulation techniques, optoelectronic tweezers (OET) has proven to be particularly useful for the assembly of large numbers of micro-and nano-objects in parallel, [22][23][24][25][26][27][28][29][30][31] and also for the assembly of micro-objects with "large" sizes (with at least one dimension greater than 150 µm). [32][33][34] However, one limitation for OET assembly (and also for other optical assembly techniques) Micromanipulation techniques that are capable of assembling nano/micromaterials into usable structures such as topographical micropatterns (TMPs) have proliferated rapidly in recent years, holding great promise in building artificial electronic and photonic microstructures. Here, a method is reported for forming TMPs based on optoelectronic tweezers in either "bottom-up" or "top-down" modes, combined with in situ photopolymerization to form permanent structures. This work demonstrates that the assembled/cured TMPs can be harvested and transferred to alternate substrates, and illustrates that how permanent conductive traces and capacitive circuits can be formed, paving the way toward applications in microelectronics. The integrated, optical assembly/preservation method described here is accessible, versatile, and applicable for a wide range of materials and structures, suggesting utility for myriad microassembly and microfabrication applications in the future.