Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

Hwang, Jaeeun; Kim, Sinhee; Ayag, Kevin Ray; Kim, Hongdoo

doi:10.5012/bkcs.2014.35.1.147

Cited by 6 publications

(3 citation statements)

References 22 publications

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“…It has a relatively easy mode of preparation and generates highly conductive film at low temperatures. Although, from a researcher's perspective and as shown in our previous work, such inks on glass substrate tend to move during thermal annealing which leads to the deformation of the printed pattern as viscosity increases at elevated temperatures. In this study, diamine (DA) was added in the formulation of the inks to preserve the conductive pattern throughout the annealing period.…”

Section: Introductionmentioning

confidence: 76%

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Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Ayag

Panama

Paul

et al. 2017

Bulletin Korean Chem Soc

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Previous studies successfully produced conductive thin films from organo‐metallic‐compounds‐based inks. Some inks like those made from copper salt and amines, however, tend to move during thermal annealing and, thus, affect the conductive pattern on the substrate. In this study, conductive inks were synthesized by forming complexes of copper with amines and/or blended amines. To build‐up an organo‐metallic framework and preserve the pattern throughout the annealing period, diamine was added to the complex in different proportions. The prepared inks were coated on glass substrate and were annealed on a hot plate at 170°C under the gaseous mixture of formic acid and alcohol for 5 min. The metallic film was observed to retain the original pattern of the ink during and after annealing. Adhesion on the substrate was also improved. Inks with blended amines produced films with lower resistivities. The lowest electrical resistivity recorded was 4.99 μΩ cm, three times that of bulk copper.

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Section: Introductionmentioning

confidence: 76%

“…Studies have been conducted to address this problem with oxidation through the introduction of capping agents to the formulation of inks . In addition, several procedures for the decomposition of inks to metallic form were modified such as laser sintering, calcination under nitrogen, hydrogen, and formic acid atmospheres.…”

Section: Introductionmentioning

confidence: 99%

Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Ayag

Panama

Paul

et al. 2017

Bulletin Korean Chem Soc

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“…Minimum resistivity of 1.70×10 -5 Ω.cm was obtained. J Hwang et al [15] synthesized conductive inks by mixing copper (II) formate and 2-ethyl-1-hexylammonium bicarbonate. Ink was coated on glass substrate and calcined at 110 o C to 150 o C under two different atmospheres such as N 2 gas and gaseous mixture of formic acid and methanol.…”

Section: Literature Reviewsmentioning

confidence: 99%

Conductive patterns by spray pyrolysis ofa self-reducing copper-amine complex ink

Ketpokasiri

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Copper conductive films were prepared by spray pyrolysis method using copper-amine complex ink. Copper-amine ink was prepared by mixing amine solution and copper (II) formate. 0.35 M of Copper (II) formate was mixed with blend amines (diethanolamine, octylamine and dibutylamine) and 4 ml of solvent. Copper-amine complex ink was coated on PI substrate by spray pyrolysis at N2 atmosphere. The effect of types of amines and molar ratio of Cuf and amine were investigated at 200oC, 25 min. of annealing time under 6 LPM of N2 atmosphere. Moreover, the effect of spraying rate was examined by varying 0.53, 0.67 and 0.8 ml/min. The volume resistivity depends on above effect. The volume resistivity was decreased when using Cuf-DEA without alkylamine and decreasing spraying rate. The lowest resistivity of 2.691 µΩ.cm was obtained at 200 ºc using 1 Cuf : 0.12 DEA, 0.53 ml/min of spraying rate, 25 min of annealing time which is about 1.57 times higher than the resistivity of bulk copper. Moreover, the well sintered layer of the film was exhibited when decreasing spraying rate.

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Particle-less reactive inks

DiGregorio¹,

Hildreth²

2023

Smart Multifunctional Nano-Inks

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Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

Cited by 6 publications

References 22 publications

Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Improved Behavior of Copper–Amine Complexes During Thermal Annealing for Conductive Thin Film Synthesis

Conductive patterns by spray pyrolysis ofa self-reducing copper-amine complex ink

Particle-less reactive inks

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