2020
DOI: 10.1021/acs.jpcb.0c02735
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Copper Electrodeposition from Deep Eutectic Solvents—Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs Glassy Carbon

Abstract: We report on the effect of the substrate on electrochemical deposition of Cu from deep eutectic solvent ethaline. We investigated the polarization behavior during electrodeposition of Cu on Pt and glassy carbon (GC) from both Cu 2+ and Cu + containing ethaline using cyclic voltammetry (CV). Formation of bulk Cu deposits on both substrates underwent nucleation and growth processes; however, the nucleation was considerably sluggish on GC compared to Pt. While experiments in Cu + solutions indicated that coalesce… Show more

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Cited by 33 publications
(25 citation statements)
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“…It is also worth mentioning methods of pattern fabrication, such as roll-to-roll (R2R) gravure printing [ 4 ] and copper electrodeposition [ 5 , 6 ]. Despite these methods offering the valuable advantage of a high production rate, these technologies, nevertheless, require expensive equipment and enormous volumes of copper plating solutions.…”
Section: Introductionmentioning
confidence: 99%
“…It is also worth mentioning methods of pattern fabrication, such as roll-to-roll (R2R) gravure printing [ 4 ] and copper electrodeposition [ 5 , 6 ]. Despite these methods offering the valuable advantage of a high production rate, these technologies, nevertheless, require expensive equipment and enormous volumes of copper plating solutions.…”
Section: Introductionmentioning
confidence: 99%
“…Considering that ethaline DES is highly‐concentrated with chloride, which is in favor of forming stable Cu(I) and Cu(II) chlorocomplexes, comparative studies in aqueous solutions containing 3 M NaCl were also carried out by Setastian et al [25] . and later Vukmirovic et al [31] . Both groups suggest that the conversion of Cu(II) and Cu(I) and Cu depositon proceed generally in same manners in the aqueous solution, although they are more facile than in DES.…”
Section: Introductionmentioning
confidence: 99%
“…[23,24] In addition, highlyconcentrated multi-components contained in DES electrolytes may also play key roles in manipulating bulk properties of electrolytes and interfacial processes during Cu deposition. [30,31] Researches on Cu electrodeposition in DES have already been carried out. In 2009, Abbott et al reported first study of Cu electrodeposition on Pt electrodes from two DES, i. e. ureacholine chloride (named reline) and ethylene glycol-choline chloride (named ethaline) containing CuCl 2 salts by cyclic voltammetry and chronoamperometry.…”
Section: Introductionmentioning
confidence: 99%
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“…24 The copper and zinc in RCS y ash and smelting slag can be leached using water or dilute sulfuric acid, and the leaching solution and leach residue can be treated using other methods. [25][26][27] However, limited information was found regarding the metal mobility and toxicity of RCS y ash and smelting slag.…”
Section: Introductionmentioning
confidence: 99%