Copper Grid/ITO Transparent Electrodes Prepared by Laser Induced Deposition for Multifunctional Optoelectronic Devices

Шестаков, Д. С.; Shishov, Andrey; Mesh, M. V.; Tumkin, Ilya I.; Makarov, Sergey; Logunov, Lev

doi:10.3103/s1062873822700691

Cited by 2 publications

(2 citation statements)

References 12 publications

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“…In this regard, DLW has provided increased degrees of freedom for the seamless integration of these components, by allowing for the writing of several highly conductive materials, appropriate for low‐power electronics integration, in several platforms, from rigid carriers to flexible substrates. In this regard, DLW processing of metal tracks has been the main approach, targeting useful metallic conductors such as copper, [ 75,137,169,196,199,246 ] silver, [ 35,42,101,118,163,336 ] platinum, [ 42 ] and liquid metals. [ 194,207,373 ] Has detailed in previous sections, attainable resolutions using these materials depend on several factors, including precursor formulations (e.g.…”

Section: Dlw‐enabled Electronicsmentioning

confidence: 99%

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Pinheiro,

Morais,

Silvestre

et al. 2024

Advanced Materials

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Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost‐effective, high‐resolution material synthesis and conversion. Concurrently, lasers participate in the patterning and assembly of functional geometries in several fields of application, of which electronics stand out. In this review, we survey and outline recent advances and strategies based on DLW for electronics microfabrication, based on laser material growth strategies. First, we summarize the main DLW parameters influencing material synthesis and transformation mechanisms, aimed at selective, tailored writing of conductive and semiconducting materials. Additive and transformative DLW processing mechanisms are discussed, to open space to explore several categories of materials directly synthesized or transformed for electronics microfabrication. These include metallic conductors, metal oxides, transition metal chalcogenides and carbides, laser‐induced graphene, and their mixtures. By accessing a wide range of material types, DLW‐based electronic applications are explored, including processing components, energy harvesting and storage, sensing, and bioelectronics. The expanded capability of lasers to participate in multiple fabrication steps at different implementation levels, from material engineering to device processing, indicates their future applicability to next‐generation electronics, where more accessible, green microfabrication approaches integrate lasers as comprehensive tools.This article is protected by copyright. All rights reserved

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Section: Dlw‐enabled Electronicsmentioning

confidence: 99%

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Pinheiro,

Morais,

Silvestre

et al. 2024

Advanced Materials

View full text Add to dashboard Cite

show abstract

“…The substrate preparation and DES coating was described in our previous works [4]. A picosecond laser (SOLAR LS) was used as a source of laser irradiation with the following parameters: wavelength of 1064 nm, pulse duration of 7 ps, frequency of 80 MHz, and average power was varied from 0.1 to 5 W. Laser irradiation was focused, and controlled using the area galvo-camera system.…”

Section: Procedures Of Laser-induced Copper Depositionmentioning

confidence: 99%

Hight speed laser-assisted copper microstructures synthesis from deep eutectic solutions

Logunov,

Yusupov,

Shestakov

et al. 2023

Advanced Laser Processing and Manufacturing VII

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Copper Grid/ITO Transparent Electrodes Prepared by Laser Induced Deposition for Multifunctional Optoelectronic Devices

Cited by 2 publications

References 12 publications

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing

Hight speed laser-assisted copper microstructures synthesis from deep eutectic solutions

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