1997
DOI: 10.1039/a702502e
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Copper(I) and silver(I) complexes of a new tetrahedrally-enforcing ligand containing two bipyridyl binding sites linked by a diphenyl disulfide bridge

Abstract: Conversion of the amino group of 6-(2-aminophenyl)-2,2Ј-bipyridine to a thiol resulted not in the expected N,N,S-terdentate chelating ligand HL [6-(2-sulfhydryl)-2,2Ј-bipyridine] but in the oxidised disulfide 2,2Ј-bis-[6-(2,2Ј-bipyridyl)]diphenyldisulfide, L᎐L. This ligand contains two bipyridyl arms linked by a diphenyl disulfide bridge in such a way that they cannot be coplanar, but tend to co-ordinate to a single metal ion with a substantial dihedral angle between the two ligand planes giving a pseudo-tetra… Show more

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Cited by 20 publications
(9 citation statements)
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“…The Cu I ion is in a tetrahedral environment with N−Cu−N angles ranging from 119.87(2) to 120.81(2)° for the eight‐membered rings and S−Cu−N angles ranging from 85.64(1) to 87.09(1)° for the five‐membered rings. The Cu−N and Cu−S distances are in the expected range 40−43. In the solid‐state, the molecules are not discrete but form a network structure through some hydrogen bonding and weak interactions.…”
Section: Resultsmentioning
confidence: 99%
“…The Cu I ion is in a tetrahedral environment with N−Cu−N angles ranging from 119.87(2) to 120.81(2)° for the eight‐membered rings and S−Cu−N angles ranging from 85.64(1) to 87.09(1)° for the five‐membered rings. The Cu−N and Cu−S distances are in the expected range 40−43. In the solid‐state, the molecules are not discrete but form a network structure through some hydrogen bonding and weak interactions.…”
Section: Resultsmentioning
confidence: 99%
“…Invariably, the ligand requires tetrahedral geometry not only with d 10 metal ions, such as Cu(I), Ag(I) and Zn(II) [18], but also with d 7 ion, such as Co(II) [12], and with d 9 ion, such as Cu(II) [17], with comparatively larger intra-ligand angle due to flattening of the MN 4 unit akin to those of structurally similar 1 : 2 complexes of 2,2′-bis(2-imidazolyl) biphenyl [12]. The Cu-N bim distances, Cu (1) (3) Å, and are larger than those in 1, consistent for pseudo-tetrahedral geometries [13]. The differences in M − N distances are attributable primarily to difference in ionic radii of the metals.…”
Section: Crystal Structures Of 1 Andmentioning
confidence: 56%
“…As shown in figure 7, the potential of the Cu I -Cu II couples are at rather anodic potentials compared to those of the parent unsubstituted ligands due to steric hindrance in the ligand, imposing a tetrahedral geometry on the metal, and from the electrochemistry results, L confers similar properties on the metal center to ligands, such as 2,9-dimethyl-1,10-phenanthroline [26], 6,6′-disubstituted-2,2′-bipyridine [27], and related compounds [3]. This type of ligands tend to stabilize pseudo-tetrahedral Cu I and to destabilize planar Cu II complexes [13], consistent with the intra-ligand angles for the complexes of L with Cu(I) and Cu(II) [17]. These results obviously show that sterically hindered ligands, such as L, stabilize the tetrahedral geometry in the solid state and also in solution.…”
Section: Cyclic Voltammetrymentioning
confidence: 99%
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