Copper(II) Oligomeric Derivatives for Deposition of Copper Thin Films

Shahid, Muhammad; Tahir, Asif Ali; Hamid, Mazhar; Mazhar, Muhammad; Zeller, Mat­thias; Molloy, Kieran C.; Hunter, Allen D.

doi:10.1002/ejic.200801053

Cited by 10 publications

(3 citation statements)

References 44 publications

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“…Recently work was undertaken to develop heterobimetallic precursors of copper with main group and transition metals for the fabrication of mixed metal oxides. 20,21 In continuation of our previous work, 22,23…”

Section: Introductionsupporting

confidence: 56%

Hexanuclear copper–nickel and copper–cobalt complexes for thin film deposition of ceramic oxide composites

et al. 2012

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Heterobimetallic molecular Cu-Ni and Cu-Co complexes [Cu 2 Ni 4 (acac) 2 (dmae) 2 (dmaeH) 2 (OH)(TFA) 6 ] (1) and [Cu 2 Co 4 (acac) 2 (dmae) 2 (dmaeH) 2 (OH)(TFA) 6 ] (2) [dmae = N,N-dimethylaminoethanol, TFA = trifluoroacetic acid and acac = 2,4-pentanedionate] were prepared and tested as precursors for the deposition of mixed metal oxide composite thin films. The complexes were synthesized by reaction of the tetrameric copper(II) complex [Cu(dmae)(TFA)] 4 with M(acac) 2 ÁxH 2 O [M = Ni, x = 2; Co, x = 1] in THF and were characterized by melting point, elemental analysis, FT-IR spectroscopy, TG/DTG and single-crystal X-ray diffraction. The complexes are isomorphous and crystallize in the triclinic centrosymmetric space group P % 1. Aerosol assisted chemical vapour deposition (AACVD) studies carried out on ( 1) and ( 2) showed that they are promising precursors for the deposition of thin films of crystalline CuO-NiO and Cu 2 O-CoO composites, respectively. The size, shape, surface morphology, microstructure, chemical composition and crystallinity of the resulting mixed-metal oxide composite thin films were analysed by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The analysis proved that the thin films are crystalline, uniform, smooth and tightly adherent to the substrates.

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Section: Introductionsupporting

confidence: 56%

Hexanuclear copper–nickel and copper–cobalt complexes for thin film deposition of ceramic oxide composites

et al. 2012

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“…The absorptions at lower frequency (512-523 cm À1 ) are due to n(Cu-O) vibrations, while the absorption bands in the range 428-461 cm À1 are assigned to n(M-N) vibrations in both cases. 19 APCI mass spectra (negative scan) of complex 1 did not show a molecular ion peak but the fragments of different m/z ratios indicating the formation of the complex were found. The largest fragment observed is [M À (dmae)] À at m/z (1130), with the base peak at m/z (865.6) corresponding to [Cu 4 (OAc) 4 Cd(dmae) 3 ] À .…”

Section: Resultsmentioning

confidence: 93%

Isostructural cage complexes of copper with cadmium or zinc for single source deposition of composite materials

et al. 2009

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Two heterometallic polynuclear complexes, [Cd 2 (OAc) 6 (m-O)Cu 4 (dmae) 4 ]ÁH 2 O (1) and its zinc analogue [Zn 2 (OAc) 6 (m-O)Cu 4 (dmae) 4 ]Á3H 2 O (2), were synthesized by simple chemical techniques. These complexes were characterized by their melting point, elemental analysis, FT-IR, APCI-MS and single crystal X-ray diffraction. The complexes consist of a common Cu 4 moiety and a Cd 2 or Zn 2 moiety in 1 and 2 with the space groups C2/c and P 1, respectively. Thermogravimetric studies prove that they can be easily thermally decomposed and can be used as precursors in aerosol-assisted chemical vapor deposition (AACVD) to yield ceramic composites that might have applications in industry and new technologies. Thin ceramic films thus deposited have good adhesion to the substrate and were characterized by SEM, EDX and powder X-ray diffractometry. SEM micrographs show morphologically evenly distributed phases that were identified by PXRD to be Cu-CdO in the case of 1 and Cu-ZnO for 2.

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“…Similarly, Cu(II) MC precursors are obtained in an analogous manner from Cu(II) salts [179][180][181][182]. In this section, we will present only a small number of examples illustrating more recent developments in the synthesis of MCs that can be used as components for metal inks.…”

Section: Metal Complexes Applicable To Inkjet Ink Formulationsmentioning

confidence: 99%

Metal-based Inkjet Inks for Printed Electronics

Kamyshny¹,

Steinke²,

Magdassi

2011

TOAPJ

370

242

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Abstract:A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.

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Copper(II) Oligomeric Derivatives for Deposition of Copper Thin Films

Cited by 10 publications

References 44 publications

Hexanuclear copper–nickel and copper–cobalt complexes for thin film deposition of ceramic oxide composites

Hexanuclear copper–nickel and copper–cobalt complexes for thin film deposition of ceramic oxide composites

Isostructural cage complexes of copper with cadmium or zinc for single source deposition of composite materials

Metal-based Inkjet Inks for Printed Electronics

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