2012
DOI: 10.5006/0616
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Copper-Induced Metal Release from Lead Pipe into Drinking Water

Abstract: The effect of added cupric ions (0 mg/L to 5 mg/L Cu +2 ) on possible deposition corrosion of lead pipe was investigated in bench-scale experiments under flowing and stagnant water conditions. Under stagnation the presence of cupric ions in the water feeding lead pipes marginally increased lead release into the water, but under continuous recirculation it could increase lead release by orders of magnitude. Other benchscale experiments investigated galvanic corrosion between lead and copper pipes under stagnati… Show more

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Cited by 29 publications
(35 citation statements)
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“…Galvanic corrosion between old lead and copper pipes Wang et al, 2012) is a potential explanation for unexplained long-term (>2 months) high concentrations following partial pipe replacements observed in the field (Sandvig et al, 2008;Britton and Richards, 1981). The presence of copper in water passing through the lead pipe has also been associated with higher lead release, possibly due to deposition corrosion or other mechanisms (Hu et al, 2012;Cartier et al, 2012;Triantafyllidou and Edwards, 2011) as well as crevice corrosion in the brass fitting used at the Pb/Cu junction (Clark et al, 2011). However, these results were obtained using new lead pipes and/or fittings, and/or without realistic flow conditions or statistical replication.…”
Section: Introductionmentioning
confidence: 97%
“…Galvanic corrosion between old lead and copper pipes Wang et al, 2012) is a potential explanation for unexplained long-term (>2 months) high concentrations following partial pipe replacements observed in the field (Sandvig et al, 2008;Britton and Richards, 1981). The presence of copper in water passing through the lead pipe has also been associated with higher lead release, possibly due to deposition corrosion or other mechanisms (Hu et al, 2012;Cartier et al, 2012;Triantafyllidou and Edwards, 2011) as well as crevice corrosion in the brass fitting used at the Pb/Cu junction (Clark et al, 2011). However, these results were obtained using new lead pipes and/or fittings, and/or without realistic flow conditions or statistical replication.…”
Section: Introductionmentioning
confidence: 97%
“…A plastic (insulating) connector 1 (example 7 in the photograph) can also be used to interrupt the lead–copper electrical connection. In laboratory studies (Cartier et al, 2012; Hu et al, 2012; Triantafyllidou & Edwards, 2011), these connections have been simulated using an insulating spacer and flexible plastic tubing, which can be operated with lead and copper electrically disconnected (example 2 in the photograph) or externally connected to allow current flow (example 3). The different connectors are expected to affect galvanic corrosion in at least four ways: by breaking the electrical connection between the copper cathode and the lead anode via an insulator or dielectric, by changing the distance between the lead anode and copper cathode of the galvanic cell, by introducing a third metal if a conductive connector is used, and by introducing a crevice. …”
Section: Introductionmentioning
confidence: 99%
“…Crevice corrosion can occur in a small gap that is sometimes created between the connector and the outside of the lead or copper pipe (Figure 2). The water sitting essentially stagnant in the crevice can become depleted in oxygen, pH can decrease as metal ions hydrolyze, and concentrations of lead and counter ions (potentially aggressive or passivating) can rise to very high levels (Nguyen et al, 2010; Rosenfeld, 1971). The effect of a crevice on corrosion rate is highly dependent on crevice geometry (Rosenfeld, 1971).…”
Section: Introductionmentioning
confidence: 99%
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“…A key thermodynamic controlling factor is the potential of the iron surface, which is affected by water chemistry; copper will plate only if the surface potential is below the threshold for plating. 5,21 Objectives. Based on expectations from both thermodynamic and mechanistic experience reported by the plating industry, 33,34 Cu(I) species are expected to plate more readily than Cu(II) species.…”
Section: Introductionmentioning
confidence: 99%