2023
DOI: 10.1016/j.apsusc.2022.155081
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Copper iodide and oxide semiconductor thin films patterned by spray-spin coating for fabricating complementary inverters: Improving stability with passivation layers

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Cited by 10 publications
(5 citation statements)
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“…76-0207). The smaller Zn 2+ (74 pm) with an ionic radius similar to Cu 1+ (77 pm) can fully complement the Cu vacancy [ 23 ]. Since a small amount of Zn 2+ was doped into CuI to fill or compensate for the Cu vacancies, the crystallinity of the material was improved, and the peak was elevated.…”
Section: Resultsmentioning
confidence: 99%
“…76-0207). The smaller Zn 2+ (74 pm) with an ionic radius similar to Cu 1+ (77 pm) can fully complement the Cu vacancy [ 23 ]. Since a small amount of Zn 2+ was doped into CuI to fill or compensate for the Cu vacancies, the crystallinity of the material was improved, and the peak was elevated.…”
Section: Resultsmentioning
confidence: 99%
“…The prepared solution is sprayed while the substrate is rotating inside a spin coater (Figure 5b). K. Lee et al patterned Zn-doped CuI (Zn:CuI) using this method to fabricate p-type TFTs where only γ-phase CuI crystals were grown [62].…”
Section: Spray-spin Coatingmentioning
confidence: 99%
“…In addition to the growth of high-quality Te thin films, the development of passivation layers is another factor that can affect the device’s performance with improved stability. Inorganic passivation layers such as Al 2 O 3 and HfO x can protect the channel layer from the penetration of surrounding H 2 O and O 2 molecules owing to their low water vapor permeability. However, the performance degradation of the TFT device is significantly observed, which can be attributed to the difference in the thermal expansion coefficients (TECs) between the active channel and passivation layers, leading to the thermal expansion mismatch and tensile/compressive strain-induced damages to the device. , Alternatively, organic polymers such as CYTOP and parylene have been widely used as a passivation layer for TFT devices, where the polymer passivation layer has the advantage of the deposition condition, which is relatively mild; thus, it may reduce the damage caused by the process. Nevertheless, it suffers from a high-water vapor transmission rate which is insufficient to prevent the penetration of moisture present in the air into the channel layer, resulting in the performance degradation of the device .…”
Section: Introductionmentioning
confidence: 99%