Correlation between interfacial bond strength and degree of healing in overprinting PAEK on CF/PAEK composites

Yi, Nan; Chen, Yu; Shen, Jiajia; Davies, Richard; Ghita, Oana

doi:10.1016/j.compositesa.2024.108217

Composites Part A: Applied Science and Manufacturing

2024

DOI: 10.1016/j.compositesa.2024.108217

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Correlation between interfacial bond strength and degree of healing in overprinting PAEK on CF/PAEK composites

Nan Yi,

Yu Chen,

Jiajia Shen

et al.

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2024

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Cited by 1 publication

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A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes

Atzler,

Hümbert,

Voggenreiter

2024

JMMP

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Fused granular fabrication (FGF) is used in industrial applications to manufacture complex parts in a short time frame and with reduced costs. Recently, the overprinting of continuous fibre-reinforced laminates has been discussed to produce high-performance, functional structures. A hybrid process combining FGF with Automated Fibre Placement (AFP) was developed to implement this approach, where an additively manufactured structure is bonded in situ onto a thermoplastic laminate. However, this combination places great demands on process control, especially in the first printing layer. When 3D printing onto a laminate, the height of the first printed layer is decisive to the shear strength of the bonding. Manufacturing-induced surface defects of a laminate, like thermal warpage, gaps, and tape overlaps, can result in deviations from the ideal geometry and thus impair the bonding strength when left uncompensated. This study, therefore, proposes a novel process flow that uses a 3D scan of a laminate to adjust the geometry of the additively manufactured structure to achieve a constant layer height in the 3D print and, thus, constant mechanical properties. For the above-listed surface defects, only thermal warpage was found to have a significant effect on the bonding strength.

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A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes

Atzler,

Hümbert,

Voggenreiter

2024

JMMP

View full text Add to dashboard Cite

show abstract

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Correlation between interfacial bond strength and degree of healing in overprinting PAEK on CF/PAEK composites

Cited by 1 publication

References 37 publications

A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes

A Workflow for the Compensation of Substrate Defects When Overprinting in Extrusion-Based Processes

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