2013
DOI: 10.1016/j.jeurceramsoc.2012.11.024
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Correlation between microstructure and electrical resistivity of hexagonal boron nitride ceramics

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Cited by 85 publications
(27 citation statements)
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“…Addition of SiC (Fig. 14b) can be observed to have resulted in weak bond between the SiC particles and the matrix which could be attributed to the difficulty in deforming SiC particles as reported by earlier researches [33].…”
Section: Fracture Surface Analysissupporting
confidence: 62%
See 1 more Smart Citation
“…Addition of SiC (Fig. 14b) can be observed to have resulted in weak bond between the SiC particles and the matrix which could be attributed to the difficulty in deforming SiC particles as reported by earlier researches [33].…”
Section: Fracture Surface Analysissupporting
confidence: 62%
“…It can be observed that electrical conductivity of Gr-Al increases with temperature and instantaneous relative density, but further improvement was achieved with the addition of Si and SiC. This observation may be as a result of the fact that addition of impurities decreases the resistivity and hence increases electrical conductivity [33,34]. At temperatures between 18.9°C and 287°C (Fig.…”
Section: Electrical Conductivitymentioning
confidence: 92%
“…Fabrication of these devices was conducted in a single chamber and not in a cleanroom facility, highlighting all-PVD direct growth advantage with no transfer/lift off or lithography required to avoid introduction of contamination or other defects. The resistivity measurements in devices with thinner a -BN samples were insulating, but less so than the reported resistivities for various phases of BN (10 13 -10 15 ohm·cm) [ 45 ] as pathways through ultrathin insulators at areas of 1600 µm 2 are predominantly caused by extrinsic effects such as dust particles and substrate topography imperfections that induce microscopic leakage pathways. A cross-sectional view of the 6.0 nm thick a -BN integrated into the device appears in Figure 5 b and a 16.5 nm a -BN in Figure S1 in the Supporting Information.…”
Section: Resultsmentioning
confidence: 71%
“…Hexagonal boron nitride has important properties such as high temperature resistance, thermal shock resistance, high thermal conductivity, poor wettability [1]. h-BN has many application elds in some industries which include automotive, glass, high temperature applications, cosmetic and steel industry [2,3].…”
Section: Introductionmentioning
confidence: 99%