Structural Dynamics of Electronic and Photonic Systems 2011 Help me understand this report
Correlation between Package‐Level High‐Speed Solder Ball Shear/Pull and Board‐Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy
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“…Board‐level testing has become the test vehicle of choice when evaluating and assuring solder joint reliability. To understand the reliability physics underlying the behavior and performance of solder materials and structures one has to understand, first of all, the behavior of the PCB itself, whether bare or carrying SMDs.…”
Section: Board‐level Testingmentioning
confidence: 99%
“…Board‐level testing has become the test vehicle of choice when evaluating and assuring solder joint reliability. To understand the reliability physics underlying the behavior and performance of solder materials and structures one has to understand, first of all, the behavior of the PCB itself, whether bare or carrying SMDs.…”
Section: Board‐level Testingmentioning
confidence: 99%
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