The impedance characteristics and ac conductivity behavior
of the
silicon oxy-carbide (SiO
x
C
y
:H) network have been investigated during its transition
from an amorphous dominated to a crystalline populated structure,
grown by varying only the growth temperature (T
S) from 160 to 180 °C. At elevated T
S, the Si nanocrystals (Si-ncs) increased in size and number
density, with corresponding elevation in crystallinity from 28 to
45%. Two distinct dielectric relaxations for the individual a-SiO
x
C
y
:H and nc-Si
components were identified in the low-frequency and high-frequency
zones, respectively, for the film deposited at higher T
S (180 °C). In contrast, for the lower T
S (160 °C)-grown film, a significant fraction of
the ultra-nanocrystalline (unc-Si) component contributed only one
consolidated relaxation peak at a moderate frequency. The scaling
measurements of the imaginary part of impedance (−Z
Im) revealed two distinct physical events for a-SiO
x
C
y
:H and nc-Si,
both being temperature scale-independent. The activation energy of
relaxation is low for the ordered nc-Si component and high for the
disordered a-SiO
x
C
y
:H matrix. According to the Bode plot analysis, the presence
of several defects in the grain boundary contributed a poor carrier
lifetime to the nc-Si component, while the a-SiO
x
C
y
:H matrix with lesser defects
had a longer carrier lifetime. An equivalent circuit model formed
by parallel resistors and constant phase elements (R||CPE), following Nyquist plot analysis, demonstrated an intense
association between the microstructural and charge carrier characteristics.
The temperature-dependent ac-conductivity behavior of the mixed-phase
material is well explained by the nonoverlapping small polaron tunneling
model, at two individual stages across a transition from an amorphous
to crystalline configuration around a small span of growth temperature.