Correlation between wear resistance and subsurface recrystallization structure in copper

Microstructural evolution of pure copper subjected to friction sliding deformation at room temperature

“…4(i)). The development of nanoscale surface structures has also been seen during wear testing of Cu, in the form of nano-mixing layers (NMLs) [21]. The NMLs seen in [21] are qualitatively different, however to the nanoscale lamellae formed during PFSD, in that the NMLs are seen to first form in small isolated pockets, and show evidence of turbulent shear flow.…”

Electrical conductivity and mechanical properties of Cu-0.7wt% Cr and Cu-1.0wt% Cr alloys processed by severe plastic deformation

“…During the past two decades the microstructure, mechanical and physical properties of bulk UFG and nanocrystalline (NC) metallic materials are studied in large amount of papers [1][2][3][4][5][6][7][8]. Therefore, the fields for further development related to Cu-Cr alloys span a wide range of different applications [9][10][11] in the electrical industry. Nevertheless, it is clear that for the fabrication of advanced installations for electrical conduction from Cu-Cr alloys use, there is a need to produce an UFG or NC microstructure with high electrical conduction properties and suitable high wear resistance (WR) and low coefficient of friction (COF) at temperature increase.…”

Effect of annealing on wear resistance and electroconductivity of copper processed by high-pressure torsion

“…The tribological properties have been studied in HPT copper [24], PSM copper chips [25], SMAT copper specimens [26], and in copper processed by dynamic plastic deformation (DPD) [27]. The smallest grain size (*200 nm) in copper was obtained by HPT [28] and by HPT combined with other SPD techniques such as ECAP, PSM, and cold rolling [29].…”