International Test Conference 1999. Proceedings (IEEE Cat. No.99CH37034)
DOI: 10.1109/test.1999.805768
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Correlation of logical failures to a suspect process step

Abstract: 1 I Traditional yield enhancement efforts have long relied on memory bibnapping techniques. With the industry marching toward system-on-a-chip technology, the importance bf logic products has increased exponentially. This necessitates the development of innovative techniques io perform logic yield enhancement. In this paper, the authors present a novel technique that can be used to peaorm logic yield enhancement. The paper concentrates on logic bitmapping at Texas Instruments. Results obtained from a few produ… Show more

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Cited by 25 publications
(7 citation statements)
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References 11 publications
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“…Similarly, in [72], [73], logic diagnosis data is overlayed with in-line inspection to identify killer defects in logic. The problem of linking electrical test failures to in-line defects was found to be very challenging, not just because the number of nets identified by an automated diagnosis tool as suspect candidates was often high, but also because a single net can spread across the entire surface of a die.…”
Section: Yield Modeling Based On Physical Failure Analysismentioning
confidence: 99%
“…Similarly, in [72], [73], logic diagnosis data is overlayed with in-line inspection to identify killer defects in logic. The problem of linking electrical test failures to in-line defects was found to be very challenging, not just because the number of nets identified by an automated diagnosis tool as suspect candidates was often high, but also because a single net can spread across the entire surface of a die.…”
Section: Yield Modeling Based On Physical Failure Analysismentioning
confidence: 99%
“…Obviously, the level of detection overlap will vary depending on the nature of the defect and the types of tests applied. Figure 3 shows various typical resistive open and bridging defects from early 90nm development that were observed in the logic defect Pareto from parts failing production stuck-at patterns using Logic Mapping [35]. Other factors are more design-centric, such as the amount of timing or voltage margin incorporated into the design combined with the aggressiveness of the corresponding tests, or the background leakage of the library elements and the type of I DDQ testing being employed.…”
Section: Empirical Test Effectiveness Studiesmentioning
confidence: 99%
“…Since its introduction, Logic Mapping has only been documented on a few industrial products, primarily as an engineering tool on a limited amount of material [1][2][3][4][5][6]. In the previous work by these authors [7] there was proof of the potential value of Logic Mapping.…”
Section: Introductionmentioning
confidence: 99%
“…
Despite the initial proof of concept being completed almost a decade ago [1], the production implementations of Logic Mapping have taken significantly longer. This paper presents an update for the SPARC™ Microprocessors, along with a discussion of some production worthiness metrics and methods applied to overcome issues on these designs.
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mentioning
confidence: 99%