Correlation of Microstructural Properties With Thermoelectric Performance of Bi0.5Sb1.5Te3 Films Fabricated by Electroplating

Koukharenko, Elena; Kuleshova, Jekaterina; Fowler, Mark; Fréty, Nicole; Tudor, John; Beeby, Steve; Nandhakumar, Iris; White, NM

doi:10.1557/proc-1267-dd10-18

Cited by 2 publications

(1 citation statement)

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“…Fleurial and co‐workers. [ 17 ] During the past two decades, as the approaches to fabrication have evolved continuously, so has the performance of μTEDs. [ 1,2,18–20 ] In 2003, Snyder et al.…”

Section: Introductionmentioning

confidence: 99%

Geometric Study of Polymer Embedded Micro Thermoelectric Cooler with Optimized Contact Resistance

Dutt

Deng

et al. 2022

Adv Elect Materials

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any moving parts and are thus maintenance free, and also environmentfriendly. [1][2][3][4] They are used for the thermal management of parts of electric circuits [5] or optoelectronic devices, [6] cooling of power electronics, [7] powering devices for the internet-of-things, [8] and body-powered wearable electronics. [9][10][11] With increased reliability and accurate temperature control, they could also be effective replacements for macroscopic thermoelectric devices (TEDs) in medical applications, [12][13][14] for example DNA replication [15] or heating and cooling experiments for treating lowgrade tissue injuries. [16] Early μTEDs were fabricated by J.-P. Fleurial and co-workers. [17] During the past two decades, as the approaches to fabrication have evolved continuously, so has the performance of μTEDs. [1,2,[18][19][20] In 2003, Snyder et al. fabricated a cross plane μTED using electrochemical deposition, which showed a maximum cooling of 2 K at 110 mA. [2] μTEDs based on superlattice materials were later fabricated but were not characterized as coolers. [21] In 2007, Huang et al. fabricated a device using MEMS technology in combination with electroplating and reported a maximum cooling of Micro-thermoelectric devices (μTEDs) are used for bio-medical applications, powering internet-of-things devices, and thermal management. For such applications, μTEDs need to have a robust packaging so that the devices can be brought in direct thermal contact with the target heat sink and source. The packaging technology developed for macroscopic modules needs improvement as it cannot be applied to μTEDs due to a large thermal resistance between the capping material and the device which deteriorates its performance. In this work, μTEDs with high net cooling temperature are fabricated by optimizing the contact resistance and device design combined with a novel packaging technique that is fully compatible with on-chip integration. The simulations and experiments demonstrate that the additional thermal loss caused by the packaging leads to an only marginal decrease in the net cooling temperature. The devices achieve a high net cooling temperature of 10.8 K without packaging and 9.6 K with packaging at room temperature. The packaging only slightly increases the thermal response time of the devices, which also shows an extremely high reliability of over 85 million cooling cycles. This simple packaging technique together with robust device performance is a step toward wide-spread application of μTEDs.The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/aelm.202101042.

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Section: Introductionmentioning

confidence: 99%