Correlation of underfill viscosity and contact angle on surfaces in a flip chip package

Sze, Ho Pei; Rasiah, I.J.; Chew, G.

doi:10.1109/eptc.2000.906371

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)

DOI: 10.1109/eptc.2000.906371

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Correlation of underfill viscosity and contact angle on surfaces in a flip chip package

Ho Pei Sze¹,

I.J. Rasiah²,

G. Chew³

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Cited by 3 publications

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No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

Kim

Baldwin

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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Correlation of underfill viscosity and contact angle on surfaces in a flip chip package

Cited by 3 publications

References 4 publications

No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

No-flow underfill process modeling and analysis for low cost, high throughput flip chip assembly

Characterization of the floating phenomena for flip chip processing with no flow underfills

No-flow underfill process optimization for high yield and reliability in flip chip assembly

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