Microelectronics Journal
 2015
DOI: 10.1016/j.mejo.2015.09.012
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Corrigendum to “Modelling of through silicon via and devices electromagnetic coupling” [Microelectron. J. 42 (2011) 316–324]

Mohamed Abouelatta
1
,
Rabah Dahmani
2
,
Olivier Valorge3
et al.
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