2009
DOI: 10.1016/j.jallcom.2009.06.101
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Corrigendum to “Superplasticity of AA5083 alloy as processed by equal channel angular extrusion” [J. Alloys Compd. 460 (2008) 305–308]

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Cited by 7 publications
(6 citation statements)
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“…The potential of UFG materials produced by ECAP to obtain a superplastic capability at very high strain rates and relatively low temperatures was first suggested several years ago, and many studies have been performed to date in this area. Some of the alloys used in those studies can be summarized to be Al-based alloys [5][6][7], Mg-based alloys [8,9], Znbased alloys (mainly Zn-22%Al alloy) [10][11][12], and copper-based alloys [13,14].…”
Section: Introductionmentioning
confidence: 99%
“…The potential of UFG materials produced by ECAP to obtain a superplastic capability at very high strain rates and relatively low temperatures was first suggested several years ago, and many studies have been performed to date in this area. Some of the alloys used in those studies can be summarized to be Al-based alloys [5][6][7], Mg-based alloys [8,9], Znbased alloys (mainly Zn-22%Al alloy) [10][11][12], and copper-based alloys [13,14].…”
Section: Introductionmentioning
confidence: 99%
“…But increasing Al 2 O 3 had no influence on a-cordierite. Torres et al 15 ,Chen,16,17 Wang et al 18 investigated the influence of CaO, ZnO, and Fe 2 O 3 additives on cordierite-based glass-ceramics. A common conclusion was reached that appropriate additives could increase the cordierite phase and decrease the melting temperature and crystallization temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Interest in alloys based on Sn-Zn eutectic as a lead-free solder is enormous. Almost all of the existing scientific articles are related to corrosion studies [18][19][20][21], to thermodynamic description [22][23][24][25], the influence of alloying additives on melting points, wetting, mechanical and electrical properties [26][27][28] and on properties solder joints [29][30][31][32]. However, there is no report in the literature that describe the effect of physicochemical properties of these alloys on the wettability and on the phenomena occurring in the solder joint.…”
Section: (3) B (2017) 309 -318mentioning
confidence: 99%