Corrosion Behavior of Corroded Sn–3.0Ag–0.5Cu Solder Alloy

See, Chuin Wern; Yahaya, Muhamad Zamri; Haliman, Habsah; Mohamad, Ahmad Azmin

doi:10.1016/j.proche.2016.03.112

Cited by 22 publications

(7 citation statements)

References 7 publications

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“…Under similar conditions, these metals have been reported to produce several different corrosion product types such as

{{\rm{Cu}}}_{2}{\rm{O}}

{\rm{CuO}}

{{\rm{Cu}}({\rm{OH}})}_{2}

{{\rm{CuCO}}}_{3}

{{\rm{Cu}}({{\rm{CH}}}_{3}{{\rm{CO}}}_{2})}_{2}

\mathrm{SnO}

{{\rm{SnO}}}_{2},{{\rm{NiO}}}_{2}

{{\rm{Ni}}}_{2}{{\rm{O}}}_{3}

{{\rm{Ni}}}_{3}{{\rm{O}}}_{4}

{{\rm{Ni}}({\rm{OH}})}_{2}

{\rm{N}}{\rm{i}}{({\rm{C}}{{\rm{H}}}_{3}{\rm{C}}{\rm{O}}{\rm{O}})}_{2}\cdot {{\rm{H}}}_{2}{\rm{O}}

. [ 23,24,38–41 ] Also, Sn‐O‐Cl corrosion type potentially in the form of

{{\rm{SnCl}}}_{2}

{{\rm{SnCl}}}_{4}

SnOCl...

…”

Section: Resultsmentioning

confidence: 99%

A comparative study on corrosion failure analysis of hearing aid devices from different markets

Yadav¹,

Ambat

2022

Materials & Corrosion

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The vulnerability of hearing aid devices to corrosion is critical due to their exposure to various kinds of ionic contaminants from the human body, such as sweat, sebum, and so forth, and harsh climatic conditions such as high temperature, humidity, and atmospheric pollutants. The device failure rate will vary depending upon the type of geographical location at which the device is used and root cause failure analysis is a crucial tool to understand the effect of geographical location on corrosion failures. In this study, field failed hearing aid devices from Europe, the United States, and Japan markets were investigated using a scanning electron microscope and elemental dispersive spectroscopy to locate failure mechanisms and causes. Information from the analysis was used for statistical analysis to compare the performance of the devices in the three markets based on failure percentage and failure probability for different parts and components. Solder terminals, battery contacts, light‐emitting diodes, and wireless‐link coil showed consistent and high failure probability across all three markets, whereas a higher failure rate for microphones was found in Europe and the United States market as compared to the Japanese market. The majority of the components corrosion failures occurred in the presence of high chloride ions from human sweat and the atmospheric conditions, whereas potassium hydroxide from the leakage of Zn–air battery was found as the additional cause for microphone failure.

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“…Under similar conditions, these metals have been reported to produce several different corrosion product types such as

{{\rm{Cu}}}_{2}{\rm{O}}

{\rm{CuO}}

{{\rm{Cu}}({\rm{OH}})}_{2}

{{\rm{CuCO}}}_{3}

{{\rm{Cu}}({{\rm{CH}}}_{3}{{\rm{CO}}}_{2})}_{2}

\mathrm{SnO}

{{\rm{SnO}}}_{2},{{\rm{NiO}}}_{2}

{{\rm{Ni}}}_{2}{{\rm{O}}}_{3}

{{\rm{Ni}}}_{3}{{\rm{O}}}_{4}

{{\rm{Ni}}({\rm{OH}})}_{2}

{\rm{N}}{\rm{i}}{({\rm{C}}{{\rm{H}}}_{3}{\rm{C}}{\rm{O}}{\rm{O}})}_{2}\cdot {{\rm{H}}}_{2}{\rm{O}}

. [ 23,24,38–41 ] Also, Sn‐O‐Cl corrosion type potentially in the form of

{{\rm{SnCl}}}_{2}

{{\rm{SnCl}}}_{4}

SnOCl...

…”

Section: Resultsmentioning

confidence: 99%

A comparative study on corrosion failure analysis of hearing aid devices from different markets

Yadav¹,

Ambat

2022

Materials & Corrosion

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“…Due to the high-temperature deposition of the molten SAC305, the surface is intermittently covered by SnO and SnO 2 [16,17] , a popular material for ESS. The capacitance of the realized capacitor 10 mm high (Fig.…”

Section: Interdigitated Electrode Architecture For Essmentioning

confidence: 99%

Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors

Khan,

Gururajan,

Koltay

et al. 2024

IEEJ Transactions Elec Engng

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This paper presents layer‐by‐layer additive manufacturing (AM) of molten metal microdroplets and dielectric materials to fabricate multilayer hybrid circuit boards featuring interdigitated 3D capacitors. The printed metal lines have a low resistance of 5 mΩ/mm, 12 times lower than state‐of‐the‐art conductive inks. Exploiting the advantages of Sn‐based oxide as an ideal candidate for Electrical Energy Storage Systems (ESS), we successfully fabricated an out‐of‐plane capacitor module using a combination of polymer and metal materials. The fabrication process exhibited an exceptional aspect ratio of 16, illustrating the successful incorporation of 20 metal layers in the out‐of‐plane capacitor module. Q factor obtained for the 3D capacitor was in the range of 66–500. Additionally, a fully automated printing technique was employed to produce a multilayer hybrid electrical printed circuit board (PCB), eliminating the need for post‐processing. This streamlined approach presents an efficient and comprehensive solution for the one‐stop printing of intricate electrical circuits. © 2024 The Authors. IEEJ Transactions on Electrical and Electronic Engineering published by Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

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“…Meanwhile, they revealed that the dispersion of small and homogeneous Ag3Sn intermetallic particles in the rich Sn matrix plays an important role in corrosion resistance, as it can determine the corrosion performance of SAC305 [11]. So far, NaCl [12,13] solution has been used in various studies on the corrosion properties of SAC305. However, such studies are limited to low pH HCl environment, which is known as highly aggressive environment for metallic alloys.…”

Section: Introductionmentioning

confidence: 99%

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

Erer

2021

International Journal of Innovative Engineering Applications

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Original scientific paperThis study aims to investigate the effects of bismuth addition on the corrosion behaviour of Sn-3.0Ag-0.5Cu (SAC 305) solder alloy in 1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) were used to examine and characterize the properties of the samples. Polarization studies indicate that the addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy does not significantly change the corrosion potentials. Instead of a true passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive region does not include a reactivation point within the scanning interval. On the other hand, the corrosion rates follow a pattern in which 1 wt.% bismuth replacement of silver causes a decrement in corrosion rate. However, the corrosion rate increases with the further replacement of silver with bismuth. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and stability of protective passive corrosion products.

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Corrosion Behavior of Corroded Sn–3.0Ag–0.5Cu Solder Alloy

Cited by 22 publications

References 7 publications

A comparative study on corrosion failure analysis of hearing aid devices from different markets

A comparative study on corrosion failure analysis of hearing aid devices from different markets

Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

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