Corrosion behavior of lead-free SAC-type solder alloys in liquid media

Wierzbicka-Miernik, A.; Guśpiel, J.; Zabdyr, L.

doi:10.1016/j.acme.2014.03.003

Cited by 27 publications

(21 citation statements)

References 11 publications

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“…This passivation film determines the corrosion behaviour of the solder in the given media. The shift to a less negative potential signifies a formation of a more stable passivation film [26], which protects the solders and increases their corrosion resistance. The polarization resistance ( ) data (Table 1) showed that Sn-Pb solder has the highest (805.250 KΩ) and lowest corrosion rate (0.1949 × 10 −2 mm/yr) compared to the lead-free solders.…”

Section: Potentiodynamic Polarization Method-tafel Plotmentioning

confidence: 99%

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Guerrero

Camacho

Mokhtari

et al. 2018

International Journal of Corrosion

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The corrosion and leaching behaviour of a new ternary Sn-0.7Cu-0.05Ni alloy in 3.5 wt.% NaCl solution is reported herein. Potentiodynamic polarization measurements show that Sn-0.7Cu-0.05Ni has the highest corrosion rate. Results of the 30-day Sn leaching measurement show that Sn-Cu-Ni joint has slight decrease attributed to the formation of thin passivation film after 15 days. The leaching amounts of Sn are observed to be higher in solder joint than in solder alloy due to the galvanic corrosion happening on the surface. EDS and XRD results of the corroded surface confirm that the corroded product is made up of oxides of tin.

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Section: Potentiodynamic Polarization Method-tafel Plotmentioning

confidence: 99%

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Guerrero

Camacho

Mokhtari

et al. 2018

International Journal of Corrosion

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“…The EIS spectra were analysed by considering the physical processes in the electrochemical reaction and constructing the corresponding equivalent network circuit of the electrochemical system. The free parameters of the model were fitted to the measured data [8][9][10][11][12] . Using the offset voltage, a simpler model of the equivalent network could be applied, consisting of a serial connection of a resistor (R1) and a constant phase element (CPE1).…”

Section: S200 S200mentioning

confidence: 99%

“…One of the most important processes that influences the solder joint, is the corrosion. This is the reason why the corrosion properties of any solder alloy are in the centre of interest [8][9][10][11][12][13] . For revealing corrosion properties of the lead free solder alloys, electrochemical methods are usually applied.…”

Section: Introductionmentioning

confidence: 99%

Characterization of the microstructure of tin-silver lead free solder

Hurtony

Szakál

Almásy

et al. 2016

Journal of Alloys and Compounds

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Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag3Sn phases.

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“…Therefore, the longest passivation stage was observed for pure tin, a shorter one for S-1 and the shortest for the S-2 alloy (Fig. 2) [15],…”

Section: Discussion Of the Resultsmentioning

confidence: 99%

“…It was most probably due to the SnO formation [15,16], and its amount was strictly related to the amount of βsn phase in the samples (increasing in the sequence S-2, S-1 and Sn). Therefore, the longest passivation stage was observed for pure tin, a shorter one for S-1 and the shortest for the S-2 alloy (Fig.…”

Section: Discussion Of the Resultsmentioning

confidence: 99%

Kinetics of Corrosion Process in H2SO4 and HNO3 Aqueous Solutions of Lead Free Sn-Ag-Cu Solder Alloys

Guśpiel

Wierzbicka-Miernik

Reczyński

2016

Archives of Metallurgy and Materials

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KInEtIcs of corrosIon procEss In H2so4 and Hno3 aquEous solutIons of lEad frEE sn-ag-cu soldEr alloysThis paper presents the results of the corrosion resistance of Sn-Ag-Cu alloys in air-saturated aqueous solutions containing NO3 -, SO4 2-ions, whose concentration was equivalent to their contents in acid rains and in concentrations 10 -100 times higher. The Ag, Cu and Sn concentrations in the corrosive media were determined using the Atomic Absorption Spectrometry. The specific dissolution rate and corrosion current were derived using the a rotating disc technique. The corrosion rate of SnAg-Cu alloys depends on pH of the examined solutions and on the concentration of oxygen near the phase boundary. In the whole range of concentrations of the applied H2SO4 + HNO3 mixtures of acids, the pure Sn was more corrosion resistant than eutectic alloy as well as the near eutectic one, following the sequence: Sn>Sn3.66Ag0.91Cu>3.8Ag0.7Cu.

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Corrosion behavior of lead-free SAC-type solder alloys in liquid media

Cited by 27 publications

References 11 publications

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution

Characterization of the microstructure of tin-silver lead free solder

Kinetics of Corrosion Process in H2SO4 and HNO3 Aqueous Solutions of Lead Free Sn-Ag-Cu Solder Alloys

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