“…Obviously, the Cl 2 acts as a key carrier, accelerating the degradation reaction of the substrate, and results in the rapid growth of the oxide layer. As identified by the SEM image of Figure 8c, the continuous volatilization of chloride and the significant structure differences of these oxides trigger high thermomechanical growth stress, which eventually results in a severe layered separation and local cracking [36] since the coefficients of thermal expansion of TiO 2 , Al 2 O 3 , and Ti6Al4V alloy are 8.2 × 10 −6 , 8.1 × 10 −6 , and 10~12 × 10 −6 K −1 , respectively [25]. Therefore, the significant difference in thermal expansion coefficients between the oxide layer and substrate eventually induces the initiation of surface ring breaking [37].…”