Corrosion effects in bifacial crystalline silicon PV modules; interactions between metallization and encapsulation

Investigation of the Ag–Si Contact Characteristics of Boron Emitters for n‐Tunnel Oxide‐Passivated Contact Solar Cells Metallized by Laser‐Assisted Current Injection Treatment

“…[5][6][7][8][9] However, using Ag/Al pastes also has other inevitable side effects due to the high activity of Al, such as a high grid resistance, [10] a limited open-circuit voltage (V OC ), [11][12][13] shunting behavior, [14] and poor module reliability. [15] To overcome these drawbacks, the use of Al-free silver paste is an important research topic in the PV community. In 2016, Kim et al reported that the contact resistance between a p þ emitter and an Ag electrode prepared with conventional Ag paste was improved by current injection treatment during firing.…”

“…More importantly, it allows the paste used on the front side of TOPCon solar cells to be Al free, thereby improving the reliability of TOPCon modules and hopefully using less expensive ethylene vinyl acetate instead of the existing expensive polyolefin elastomers for module encapsulation. [15,29] To unlock the potential of the LECO process in TOPCon solar cells, it is necessary to further investigate the microscale contact characteristics and Ag-Si contact mechanism of LECO on boron-doped p þ emitters of TOPCon solar cells, which are very few studies at present. In this work, we have comparatively studied the effects of microscale interfacial contact characteristics on the p þ emitters and electrical properties of n-type TOPCon solar cells metalized using the existing Ag/Al paste process and LECO process with a special Al-free Ag paste.…”