Corrosion Inhibition of Brazing Cu-Ag Alloy with 1,2,3-Benzotriazole and 2,5-Dimercapto-1,3,4-Thiadiazole

Abstract

Adsorption and inhibition behavior of 1,2,3-benzotriazole (BTA) and 2,5-dimercapto-1,3,4-thiadiazole (DMTD) on brazing Cu-Ag alloy was studied in deionized water using potentiodynamic polarization measurement, adsorption isotherm investigation and X-ray photoelectron spectroscopy (XPS). Pure Ag and pure Cu were included to investigate the mere effect of each component on the alloy’s behavior. Results show better inhibition of DMTD for Ag and BTA for Cu, both by chemisorption. BTA was found to follow Langmuir isotherm while DMTD obeyed Temkin adsorption isotherm, despite both acting as a mixed type inhibitor. Combining the two inhibitors increased the inhibition efficiency over 80% for the Cu-Ag alloy. XPS spectra demonstrate the formation of DMTD protective film through DMTD’s functional groups of pyrrolic N from the azole ring and thiol S from the mercapto anchoring group on Ag and thiol S on Cu. Compared to BTA, the higher affinity of DMTD to Ag was attributed to the involvement of two heteroatoms with the Ag surface.

Ag Electrode Anticorrosion in Inverted Perovskite Solar Cells

“…Tafel curve is a typical method to investigate the corrosion behavior of metal, where corrosion current ( I c ) represents corrosion rate and self‐corrosion potential ( E c , at which the corrosion current is smallest) represents corrosion tendency. [ 33 ] As shown in Figure 2d, the major difference in Tafel curves appears in the anodic section (right section), indicating that MBT mainly affects the anodic oxidation process of Ag film. In anodic region, the corrosion current of Ag film is always twice higher than that of MBT/Ag film, indicating a much faster corrosion rate of Ag film.…”

Chemical and Electrochemical Study of Effect of Soluble Sulfonated Polystyrene on Mild Steel Interface in Hydrochloric Acid Solution

“…Various isotherms were tested with the parameters calculated from the weight loss data and it is found that the Langmuir isotherm is best suited isotherm for the adsorption for SPS inhibitor for mild steel surface at 100ppm concentration of inhibitor at 0.5M HCl at 35°C for 3h duration reported in Figure 3. It has been found after the examination of the Figure 3 that the value of regression coefficient (R 2 ) is about to be unity, represents the finest definition of adsorption activity by isothermal adsorption by Langmuir [26,42,51].…”

“…During the path changes, both cathodic and anodic reactions were shown to be affected by the inhibitor. However, the impact is more prominent compared to that in anodic polarization plots in cathodic polarization plots [42,51]. Since the measurements βc and βa in Tables 3 change with an increase in the inhibitor concentration, a high βc value indicates that the cathodic reaction is more delayed than the anodic [52].…”

“…Polarization resistance (RP) have been carried out at -0.20 mV to +0.20 mV with an average scan rate of 0.125 mV/sec after the steady state and can be found by the relation between working electrode surface area (A), and potential change dE and di using equation ( 6), whereas IE% has been reported with and without inhibitor, using the equation reported by researchers [27,42,43]. The basic electrochemical impedance parameter like solution resistance (Rs), admittance parameter (Yo), total number of parts (n), resistance to charges transfers (Rct), and double electric layer capacitance (Cdl) be located to calculate the adhesion of atoms in metal and acid grains interface due to the potential difference between solution and electrode at corrosion state Using the equation [44,45].…”

Evaluation of Corrosion inhibition properties of pharmaceutically active compound Cefotaxime sodium on mild steel surface in sulfuric acid medium

“…Adsorption of drug inhibitor molecules causes polarization resistance Rp, which increases with the number of adsorbed molecules. Furthermore, the adsorbed inhibitor film reduces capacitance at the metal-solution interface as a result of a reduction in the dielectric constant between metal and electrolyte and/or an improvement in thickness of metal (48)(49)(50).…”