1996
DOI: 10.1016/0254-0584(96)80131-3
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Corrosion of copper in both aqueous ethylenediamine and its complexes with some transition metal ions

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Cited by 8 publications
(3 citation statements)
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“…Mahdavian et al have studied the effect of ligand size of Zn complexes on the corrosion inhibition of mild steel [ 13 ], same researchers also reported the corrosion protection performance of different transition metals complexes of acetylacetonate [ 14 ]. Sayed et al used ethylenediamine as ligand [ 15 ] for some transition metal complexes and studied for protection of copper. The correlation between corrosion inhibition activity of the ligands and their Co(III) complexes have been discussed by Khaled and coworkers [4] on the basis of electrochemical methods and molecular modeling data.…”
Section: Introductionmentioning
confidence: 99%
“…Mahdavian et al have studied the effect of ligand size of Zn complexes on the corrosion inhibition of mild steel [ 13 ], same researchers also reported the corrosion protection performance of different transition metals complexes of acetylacetonate [ 14 ]. Sayed et al used ethylenediamine as ligand [ 15 ] for some transition metal complexes and studied for protection of copper. The correlation between corrosion inhibition activity of the ligands and their Co(III) complexes have been discussed by Khaled and coworkers [4] on the basis of electrochemical methods and molecular modeling data.…”
Section: Introductionmentioning
confidence: 99%
“…The corrosion rate of copper decreased in the following order: En ӷ Cu complex ӷ Cd complex Ͼ Zn complex Ͼ Ni complex. 16 Survila et al 17,18 recently analyzed thermodynamic and kinetic aspects of Cu 2 O formation in ethylenediamine. Their work indicates that copper solubility ex-pands over a wider pH range in the presence of ethylenediamine.…”
mentioning
confidence: 99%
“…The study of corrosion and corrosion inhibitors for this metal is also investigated [1][2][3][4][5][6][7][8]. There is a general agreement in the literature that the anodic layers, on the copper surface, presents a simple (Cu 2 O) or a duplex (Cu 2 O/CuO, Cu(OH) 2 ) structure, and depend on both the electrode potential and the presence of buffering ions (basic or acids), which have different effects on the anodic reaction of copper, such ions participating in the reactions involving the dissolution of the metal and the passive film formation [6,9].…”
Section: Introductionmentioning
confidence: 99%