“…The study of corrosion and corrosion inhibitors for this metal is also investigated [1][2][3][4][5][6][7][8]. There is a general agreement in the literature that the anodic layers, on the copper surface, presents a simple (Cu 2 O) or a duplex (Cu 2 O/CuO, Cu(OH) 2 ) structure, and depend on both the electrode potential and the presence of buffering ions (basic or acids), which have different effects on the anodic reaction of copper, such ions participating in the reactions involving the dissolution of the metal and the passive film formation [6,9].…”