Corrosion of metallic materials

Tullmin, Martin; Roberge, P.R.

doi:10.1109/24.387383

Cited by 44 publications

(15 citation statements)

References 3 publications

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“…Pitting attack with chlorides is autocatalytic. After the chloride ions have destroyed the passive film and initiated pitting, a corrosive climate is established within the pit that facilitates metal dissolution, leading self-stimulated type of corrosion attack [13]. It is very important to know that how the applied voltages affect TTF during the WDT.…”

Section: Methodsmentioning

confidence: 99%

Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

Lee

Jung

Lee

et al. 2009

2009 59th Electronic Components and Technology Conference

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As electronic packages become smaller in size, the pitch of metal line is getting shorter. Decrease of line pitch in electronic packages and substrate of electronic component causes the electrochemical migration (ECM) more frequently. If the electronic components are exposed to high temperature and high humidity environments with authorized voltage condition, the metals in packages and substrate are easily ionized and form conductive dendrites, leading to insulation failure. ECM process consists of three steps: anodic dissolution, ion migration, and dendritic growth. The first step is the most important because anodic dissolution determines strongly affect the occurrence of remaining steps. In this work, anodic dissolution of Sn solder is characterized by water-drop test (WDT) and anodic polarization teat (APT). Initial anodic dissolution current of Sn solder is measured in 0.001 wt.% NaCl, Na 2 SO 4 solutions and deionized water by WDT, and the results were compared with APT results. It is found that the higher the voltage is, the shorter the time-tofailure (TTF) is. In lower-voltage condition, anodic dissolution current is limited by passivity formation. The pitting corrosion occurred in higher voltage condition with shorter TTF. The anodic dissolution current is dependent on the electrolyte: the highest value in 0.001 wt.% NaCl solution and lowest value in D.I water. IntroductionElectronic components are moving towards miniaturization and high-density integration. Therefore the pitches between the metal lines of packaging in electronic systems are getting smaller. The metal lines used under high humidity, high temperature and high voltage-applied conditions are prone to be electrochemically unstable and ionized [1][2][3][4]. The formed metal ions move from anode to cathode by electric filed through non metallic medium and a conductive metal filament forms between the anode and the cathode. Filaments formed near the anode are called conductive anodic filaments (CAFs), and those formed on the cathode are called dendrites. They are closely related to the insulation failure which leads to malfunction and final failure of the electronic devices. This phenomenon is called electrochemical migration (ECM) or ion migration. ECM is known to be correlated with the corrosion characteristics of the anode in terms of anodic dissolution.ECM process is composed of three steps: anodic dissolution, ion migration, and dendritic growth. Actually, ECM is initiated by anodic dissolution of electrode metal and this is critical process of ECM failure. Acceleration condition of harsh environment can be made using water-dropped situation with voltage bias which is called water-drop test

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Section: Methodsmentioning

confidence: 99%

Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

Lee

Jung

Lee

et al. 2009

2009 59th Electronic Components and Technology Conference

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“…In addition to thermal excursions, the interfaces also have to withstand any effects of moisture from the humidity in the surrounding environment. It has been reported that local delamination at the adhesive/chip or adhesive/substrate can lead to crack propagation, and moisture can be absorbed and diffuse through the delaminated area [7,8]. Moisture diffusion results in corrosion of the metal and a decrease in the ability of the adhesive to provide mechanical support [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Adhesive strength of flip chip packages

Chiang

Chan

Ralph

et al. 2008

International Journal of Adhesion and Adhesives

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“…Moreover, the package encapsulant is a moisture absorber and it contains certain level of impurities, placing the devices at the risk of chemical attack [1]. During corrosion process, metallic material reacts with its environment and is being converted to corrosion products which are thermodynamically stable [2].…”

Section: Introductionmentioning

confidence: 99%

“…Oxidation is the loss of electrons from the electrode into the external circuit. Reduction is the gain of electrons from the external circuit into the electrode [2,3].…”

Section: Introductionmentioning

confidence: 99%

Failure analysis for probe mark induced galvanic corrosion and bond degradation during HAST

Yeoh¹,

Chong²,

Li³

2013

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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Understanding the corrosion failure mechanism is vital in designing reliable microelectronic products. We stimulated corrosion on Cu-wired memory device with probe mark damage at the center of Al bond pad. Deep probe marks can trigger pitting corrosion and galvanic corrosion on bond pads in the presence of moisture and corrosive halide ions, resulting in intermetallic deterioration and bond degradation. Strict controls have been implemented to avoid excessively deep probe-mark depth and also to restrict the number of touch-downs during wafer sort testing in order to ensure the strength of the bond pad structure under severe environmental conditions.

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Corrosion of metallic materials

Cited by 44 publications

References 3 publications

Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

Effect of initial anodic dissolution current on the electrochemical migration phenomenon of Sn solder

Adhesive strength of flip chip packages

Failure analysis for probe mark induced galvanic corrosion and bond degradation during HAST

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