2014
DOI: 10.1108/ssmt-01-2013-0001
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Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution

Abstract: Purpose – The purpose of this paper is to examine the corrosion behaviors of SAC305 thin film solder alloy in 6 M KOH solution. Design/methodology/approach – The corrosion behavior of bare Cu, as-deposited SAC305/Cu and as-reflowed SAC305/Cu thin films at varying temperatures, was investigated by means of potentiodynamic polarization in a 6 M KOH solution. The microstructure, phase and thickness of the intermetallic compounds formed were… Show more

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Cited by 5 publications
(2 citation statements)
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“…This differs sometimes (Lin et al , 1998; Mohanty and Lin, 2006, 2007, 2008) according to the metal system used. The common potential range used was −2.0 to +2.0 V (against Hg/HgO) in an alkaline solution (Liew et al , 2012; Mei Lee et al , 2014; Nazeri and Mohamad, 2014a, 2014b, 2016a, 2016b).…”
Section: Corrosion Of Sn-zn Soldersmentioning
confidence: 99%
“…This differs sometimes (Lin et al , 1998; Mohanty and Lin, 2006, 2007, 2008) according to the metal system used. The common potential range used was −2.0 to +2.0 V (against Hg/HgO) in an alkaline solution (Liew et al , 2012; Mei Lee et al , 2014; Nazeri and Mohamad, 2014a, 2014b, 2016a, 2016b).…”
Section: Corrosion Of Sn-zn Soldersmentioning
confidence: 99%
“…SAC305 solder was known for having comparable properties to Sn-Pb solder [10,13,14]. To ensure lead-free solder is fully reliable to replace Sn-Pb solders, corrosion resistance aspect needed to be fully address [15,16]. Modern electronics technology such as cellular phone, laptop, camera and others are mostly portable and the risk of exposure towards corrosion environment are higher [17].…”
Section: Introductionmentioning
confidence: 99%