Nickel was deposited on a copper substrate from aqueous and nonaqueous ethanol electrolytes. X‐ray photoelectron spectroscopy, electrochemical impedance spectroscopy and chronovoltametry, scanning electron microscopy, and atomic force microscopy were used to study the effect of the solvent on the surface and corrosion properties of the Ni coatings formed. Unifom and relatively smooth Ni films were obtained as measured with microscopy techniques. The formation of a passive film in acidic, alkaline, and neutral chloride‐containing media was confirmed with X‐ray photoelectron spectroscopy. The water‐based nickel‐plating electrolyte makes it possible to deposit coatings with higher corrosion resistance as compared with coatings deposited from ethanol electrolyte in NaOH and NaCl media. The proposed mechanism of corrosion in a 0.5 M H2SO4 solution involves cycles of active‐passive surface behavior due to its passivation by corrosion products.