2021
DOI: 10.2528/pierl21070103
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Cost-Effective Surface-Mount Patch Antenna With Ring Slot Using Ball Grid Array Packaging for 5g Millimeter-Wave Applications

Abstract: The letter presents a compact, cost-effective, and surface-mount patch antenna element for 5G millimeter-wave (mmWave) system integration. The antenna element adopts ball grid array (BGA) packaging technology to achieve surface mount function, which can be applied to highly integrated systems. By adding a ring slot on the radiating patch, the proposed antenna obtains a wider impedance bandwidth. The antenna prototype has been simulated, manufactured, and verified. The proposed antenna element size is 5 mm × 5 … Show more

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Cited by 2 publications
(1 citation statement)
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“…To suit costeffective needs, an FR4 printed circuit board has recently been used as the substrate. Many low-cost mm-wave antennas [26][27][28][29][30][31][32] have been reported, including planar inverted-F antennas (PIFA) [28], U-shaped slot patch antennas [29], ball grid array (BGA) packaged ring slot antennas [30], BGA surface-mount bowtie antenna [31], and double-curved metal in multilayer printed circuit boards [32].…”
Section: Introductionmentioning
confidence: 99%
“…To suit costeffective needs, an FR4 printed circuit board has recently been used as the substrate. Many low-cost mm-wave antennas [26][27][28][29][30][31][32] have been reported, including planar inverted-F antennas (PIFA) [28], U-shaped slot patch antennas [29], ball grid array (BGA) packaged ring slot antennas [30], BGA surface-mount bowtie antenna [31], and double-curved metal in multilayer printed circuit boards [32].…”
Section: Introductionmentioning
confidence: 99%