Cost-efficient copper-nickel alloy for active cooling applications

Li, Shuai; Snyder, Kyle; Akhanda, Md Sabbir; Martukanitz, Richard; Mitra, Mandar; Poon, Joseph; Zebarjadi, Mona

doi:10.1016/j.ijheatmasstransfer.2022.123181

Cited by 17 publications

(13 citation statements)

References 25 publications

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“…Similarly, an unusually high Seebeck effect is found in isovalent NiCu alloys, exploited in thermocouples. Over the last few years, there have been several attempts to enhance the TE properties of NiCu alloys (17)(18)(19)(20)(21), yet a clear strategy to effectively optimize the electronic structure and thereby boost the TE performance is still lacking. Thus, with some exceptions (22)(23)(24), metals have been largely overlooked by the majority of the TE community, dismissing interband scattering as a potential route to design thermoelectrics.…”

Section: Resultsmentioning

confidence: 99%

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High thermoelectric performance in metallic NiAu alloys via interband scattering

Garmroudi,

Parzer,

Riss

et al. 2023

Sci. Adv.

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Thermoelectric materials seamlessly convert thermal into electrical energy, making them promising for power generation and cooling applications. Although historically the thermoelectric effect was first discovered in metals, state-of-the-art research focuses on semiconductors. Here, we discover unprecedented thermoelectric performance in metals and realize ultrahigh power factors up to 34 mW m −1 K −2 in binary Ni x Au 1– x alloys, more than twice larger than in any bulk material above room temperature, reaching zT max ∼ 0.5. In metallic Ni x Au 1– x alloys, large Seebeck coefficients originate from electron-hole selective scattering of Au s electrons into more localized Ni d states. This intrinsic energy filtering effect owing to the unique band structure yields a strongly energy-dependent carrier mobility. While the metastable nature of the Ni-Au system as well as the high cost of Au pose some constraints for practical applications, our work challenges the common belief that good metals are bad thermoelectrics and presents an auspicious route toward high thermoelectric performance exploiting interband scattering.

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Section: Resultsmentioning

confidence: 99%

“…Data have been obtained at TU Wien, Austria (unfilled symbols) and the National Institute for Materials Science (NIMS), Japan (filled symbols). The power factor of the well-known Ni-Cu system is plotted for comparison ( 17 , 20 , 29 ). ( D ) Composition-dependent figure of merit of Ni-Au and Ni-Cu binary alloy systems.…”

Section: Resultsmentioning

confidence: 99%

High thermoelectric performance in metallic NiAu alloys via interband scattering

Garmroudi,

Parzer,

Riss

et al. 2023

Sci. Adv.

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“…The industrial powder mixture, consistin Cu and 35% Ni (wt.%), was used as the feedstock powder. The parameters emp the production of different samples are listed in Table 6 [94].…”

Section: Parameter Valuementioning

confidence: 99%

“…In a recent study, Li et al [94] produced a copper-nickel alloy for active cooling applications using the L-DED method. The industrial powder mixture, consisting of 65% Cu and 35% Ni (wt.%), was used as the feedstock powder.…”

Section: Parameter Valuementioning

confidence: 99%

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Advancements in Additive Manufacturing for Copper-Based Alloys and Composites: A Comprehensive Review

Vahedi Nemani,

Ghaffari,

Sabet Bokati

et al. 2024

JMMP

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Copper-based materials have long been used for their outstanding thermal and electrical conductivities in various applications, such as heat exchangers, induction heat coils, cooling channels, radiators, and electronic connectors. The development of advanced copper alloys has broadened their utilization to include structural applications in harsh service conditions found in industries like oil and gas, marine, power plants, and water treatment, where good corrosion resistance and a combination of high strength, wear, and fatigue tolerance are critical. These advanced multi-component structures often have complex designs and intricate geometries, requiring extensive metallurgical processing routes and the joining of the individual components into a final structure. Additive manufacturing (AM) has revolutionized the way complex structures are designed and manufactured. It has reduced the processing steps, assemblies, and tooling while also eliminating the need for joining processes. However, the high thermal conductivity of copper and its high reflectivity to near-infrared radiation present challenges in the production of copper alloys using fusion-based AM processes, especially with Yb-fiber laser-based techniques. To overcome these difficulties, various solutions have been proposed, such as the use of high-power, low-wavelength laser sources, preheating the build chamber, employing low thermal conductivity building platforms, and adding alloying elements or composite particles to the feedstock material. This article systematically reviews different aspects of AM processing of common industrial copper alloys and composites, including copper-chrome, copper-nickel, tin-bronze, nickel-aluminum bronze, copper-carbon composites, copper-ceramic composites, and copper-metal composites. It focuses on the state-of-the-art AM techniques employed for processing different copper-based materials and the associated technological and metallurgical challenges, optimized processing variables, the impact of post-printing heat treatments, the resulting microstructural features, physical properties, mechanical performance, and corrosion response of the AM-fabricated parts. Where applicable, a comprehensive comparison of the results with those of their conventionally fabricated counterparts is provided.

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Computational Modeling and Simulation of the Microwave Hybrid Heating Process: A State of the Art Review

Singh,

Sehgal

2023

Arch Computat Methods Eng

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Cost-efficient copper-nickel alloy for active cooling applications

Cited by 17 publications

References 25 publications

High thermoelectric performance in metallic NiAu alloys via interband scattering

High thermoelectric performance in metallic NiAu alloys via interband scattering

Advancements in Additive Manufacturing for Copper-Based Alloys and Composites: A Comprehensive Review

Computational Modeling and Simulation of the Microwave Hybrid Heating Process: A State of the Art Review

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