2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) 2018
DOI: 10.1109/vlsi-tsa.2018.8403865
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Cost-efficient sub-lithographic patterning with tilted-ion implantation (TII)

Sangwan Kim
1
,
Peng Zheng
2
,
Kimihiko Kato
3
et al.
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