Cost of ownership – projecting the future

Trybula, Walt

doi:10.1016/j.mee.2005.12.019

Cited by 18 publications

(12 citation statements)

References 2 publications

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“…Several TCO models have been proposed for heterogeneous kinds of machinery. The production equipment addressed includes assembly lines and networks [36][37][38], production lines [13,39] and production machines [19,40,41]. Other authors focus on heavy equipment, such as construction and mining machines [42] and forklifts [43].…”

Section: Application Of the Tco Methodology To The Machinery Industrymentioning

confidence: 99%

“…In particular, whereas several authors use the TCO methodology to merely compare the cost effectiveness of alternative equipment [43,45,48], others have addressed the effects of machine productivity [36,37,40,46], failure rate or expected duration of critical components [47,49] or end user's operational modalities [13,39,41] on the TCO of a machine.…”

Section: Application Of the Tco Methodology To The Machinery Industrymentioning

confidence: 99%

“…Thus, authors have already explored the adoption of output-dependent TCO indicators [36,40,46] and the integration between the TCO and the Overall Equipment Effectiveness (OEE) [37] or the environmental impact of the machine [13,39].…”

Section: Application Of the Tco Methodology To The Machinery Industrymentioning

confidence: 99%

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Investment and Management Decisions in Aluminium Melting: A Total Cost of Ownership Model and Practical Applications

et al. 2018

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The well-established Total Cost of Ownership (TCO) concept has been applied to several durable goods industries, including machinery. However, none of the existing TCO models explicitly focus on such highly energy-intensive equipment as metal melting furnaces. In this paper, an application of the TCO concept to aluminium melting furnaces is explored. A TCO model is created and tested through seven case studies in the aluminium die casting industry. Results indicate that the capital expenditure (CAPEX) incurred by the sample companies accounts for only 3–5% of a furnace TCO. Moreover, the melting technology implemented in the furnace highly impacts its TCO, as both the furnace’s thermal efficiency and melting loss (i.e., the fraction of aluminium burnt during the melting process) significantly affect the costs incurred. Moreover, the sample furnaces’ cost effectiveness clearly relies on scale. This evaluation leads to identify technological and managerial levers to reduce a furnace TCO, e.g., by adopting energy-efficient furnaces and by installing centralized, large-sized furnaces to pursue scale economies.

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Section: Application Of the Tco Methodology To The Machinery Industrymentioning

confidence: 99%

Section: Application Of the Tco Methodology To The Machinery Industrymentioning

confidence: 99%

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Investment and Management Decisions in Aluminium Melting: A Total Cost of Ownership Model and Practical Applications

et al. 2018

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“…Nano-roughness is also very important in nanostructures and nano-devices (Gogolides et al, 2006). Nano-imprinting is a potential patterning technology (Trybula, 2006). Imprint lithography is proposed as a low-cost method for next generation lithography for fabrication of IC chips (Maltabes and Mackay, 2006).…”

Section: Introductionmentioning

confidence: 99%

Wire bonding using copper wire

Zhong

2009

Microelectronics International

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Purpose-This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach-Dozens of journal and conference articles published recently are reviewed. Findings-The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support structures are briefly analysed. The solutions to the problems and recent findings/developments in wire bonding using copper wire are discussed. Research limitations/implications-Because of page limitation of the paper, only a brief review is conducted. Further reading is needed for more details. Originality/value-This paper attempts to provide introduction to recent developments and the trends in wire bonding using copper wire. With the references provided, readers may explore more deeply by reading the original articles.

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“…Nano-imprinting is a potential patterning technology (Trybula, 2006). Imprint lithography may be a low-cost method for next generation lithography to fabricate IC chips with nodes of 45 nm and below (Maltabes and Mackay, 2006).…”

Section: Introductionmentioning

confidence: 99%

Wire bonding of low‐k devices

Zhong

2008

Microelectronics International

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to review recent advances in wire bonding of low-k devices. Design/methodology/approach -Dozens of journal and conference articles published in 2005-2008 are reviewed. Findings -The paper finds that many articles have discussed and analysed problems/challenges such as bond pad metal peeling/lift, non-sticking on pad, decreased bonding strength and lower wire-bond assembly yield. The paper discusses the articles' solutions to the problems and recent findings/ developments in wire bonding of low-k devices.Research limitations/implications -Because of the page limitation, only brief discussions are given in this paper. Further reading is needed for more details.Originality/value -The paper attempts to provide an introduction to recent developments and the trends in wire bonding of low-k devices. With the references provided, readers may explore more deeply by reading the original articles.

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Cost of ownership – projecting the future

Cited by 18 publications

References 2 publications

Investment and Management Decisions in Aluminium Melting: A Total Cost of Ownership Model and Practical Applications

Investment and Management Decisions in Aluminium Melting: A Total Cost of Ownership Model and Practical Applications

Wire bonding using copper wire

Wire bonding of low‐k devices

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