Coupled thermal-mechanical simulation methodology to estimate BGA reliability of 2.5D Packages

Nayini, Manish; Horn, Timothy; Patel, J.H.; Burrell, Lloyd

doi:10.1109/ectc32862.2020.00259

Cited by 5 publications

(2 citation statements)

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“…The heat dissipation performance of HFCBGA packages can be improved further yet through their integration with an external heat sink or an air fan (see Figure 2 ) to force the heat flow upward and convection cooling use to remove excess heat. However, the additional load imposed by the heat sink and fan increases the risk of solder joint cracking at the point where the package is mounted on the PCB ( Figure 3 shows the occurrence of solder joint fracture in the HFCBGA package mounted on the PCB with a heatsink) [ 10 ]. To improve the packaging yield rate, it is therefore necessary to properly understand the board-level fatigue reliability of advanced high-power consumption packages under coupled mechanical load and thermal cycling conditions.…”

Section: Introductionmentioning

confidence: 99%

“…The results showed that the thermal resistance of the chip was reduced by around 44% compared to that of a conventional cold-plate cool- The heat dissipation performance of HFCBGA packages can be improved further yet through their integration with an external heat sink or an air fan (see Figure 2) to force the heat flow upward and convection cooling use to remove excess heat. However, the additional load imposed by the heat sink and fan increases the risk of solder joint cracking at the point where the package is mounted on the PCB (Figure 3 shows the occurrence of solder joint fracture in the HFCBGA package mounted on the PCB with a heatsink) [10].…”

Section: Introductionmentioning

confidence: 99%

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Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

et al. 2023

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Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of −40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%