Coupling effects at Cu(Ni)–SnAgCu–Cu(Ni) sandwich solder joint during isothermal aging

Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint

“…Normally, the material with higher melting point will have higher standard Gibbs function of molar reaction. Besides, the scallop-like IMCs were found to gradually change into planar ones with increasing aging time, which is in accord with that observed in the case of Cu substrates [29,30].…”

“…This is because the time used to diffuse the atoms through the thicker IMC layers is gradually increasing with the increase in thickness of IMCs. As is well known, there is a parabola function between the aging time and the thickness of the IMCs based on abundant data available under the solid-state aging [20,23,[29][30][31]. There are many researches on Sn-Ag-Cu/Cu substrate [29,30,32,33], however, there are few reports on Sn-Ag-Cu/Ag joint, especially on Sn-Ag-Cu/Ag single crystal joint.…”

Reliability of lead-free solder joints with different PCB surface finishes under thermal cycling

“…EDX analysis revealed that the composition of interfacial IMC was Cu6Sn5 containing about 2 at% nickel. The nickel content was diffused from the FeNi lead of device due to a coupling effect between the lead/solder and solder/PCB interfaces [7,11]. The precipitates in the bulk solder were binary Cu6Sn5.…”

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

“…However, for the Sn-4Ag-3Zn couple, the IMC growth mechanism is approximately parabolic, which is similar to most interfacial reactions. 41,42 For the Sn-4Ag-3Zn and Sn-4Ag-7Zn solders, Ag-Zn IMCs were often formed at the interface in the initial stage during the reflow procedure. However, with extended aging time, the Ag-Zn IMC was transformed into Ag 59 Zn 29 Sn 12 .…”