Cover Picture: Plasma Process. Polym. 2/2006

Abstract

Cover: AFM scans (5µm × 5µm) of 500 nm thick films as deposited on Si from processes a) RFICP (full vertical scale: 12.6 nm), b) MIRA (full vertical scale: 44.9 nm), and c) DECRP (full vertical scale: 27.7 nm). Further details can be found in the Full Paper by P. Supiot,* C. Vivien, A. Granier, A. Bousquet, A. Mackova, D. Escaich, R. Clergereaux, P. Raynaud, Z. Stryhal, and J. Pavlik on page 100.

Adhesion Improvement between Epoxy and Stainless Steel Using a Silane Coupling Agent in an Atmospheric Plasma Process

“…[36][37][38][39] Generally, these deposited films are described as branched, highly cross-linked, insoluble in nature, pinhole free, and highly adhesive to most of the substrates. [40][41][42] A plasma deposited siloxane layer can act as an interfacial modifier for improving adhesion and corrosion resistance creating chemical bonds between the siloxane and metal interface. [43] The deposition of polyhydrogenmethylsiloxane and tetraethyl orthosilicate on SS substrates improved the adhesion strength towards silicon elastomers.…”

Preparation and characterization of thin organosilicon films deposited on SPR chip

“…Organosilicon films were obtained using remote plasmaenhanced CVD decomposition of 1,1,3,3,-tetramethyldisiloxane precursor (TMDSO) premixed with oxygen induced in a N 2 plasma afterglow [12]. The formed plasma polymer (p-TMDSO) film was deposited at room temperature on the gilded slide glass plate with a deposition rate of 0.14 nm s −1 .…”

“…Different technologies based on plasma-enhanced chemical vapor deposition (PECVD) processes are available to deposit organosilicon plasma polymers. Their advantage over chemical processes is the wide range of settings and changeable parameters such as the gas flow rates, the gas ratio, the type of plasma used, which enable to accurately control the growing film characteristics such as the refractive index, the thickness, and the extinction coefficient [12][13][14][15]. Organosilicon films with thicknesses between 500 nm and 1 mm have been deposited on (1 1 1) silicon wafer substrates using the PECVD technique and the film structure, optical properties and morphology have been investigated using FT-IR spectroscopy, ellispometry, X-ray reflectivity, atomic force microscopy (AFM), and contact angle measurements [12].…”

From Materials Science to Catalysis: Influence of the Coating of 2D- and 3D-Inserts on the Catalytic Behaviour of VOx/TiO2 in Oxidative Dehydrogenation of Propane

“…The tetramethyldisiloxane (TMDSO) monomer was polymerized to ppTMDSO by Remote Plasma Enhanced Chemical Vapor Deposition (RPECVD) [31]. TMDSO (25 cm 3 /min) was co-fed with O 2 (5 cm 3 /min) at 550 Pa in the cold zone, far (at 1 m) from the microwave discharge, in the presence of plasmagenic atomic nitrogen species that flowed over the sample holder.…”