2002
DOI: 10.1149/1.1430717
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Cr(VI) and Ce(III) Inhibition of Oxygen Reduction on Copper

Abstract: Oxygen reduction on Cu in near-neutral 5% NaCl and its subsequent inhibition by Cr͑VI͒ and Ce͑III͒ compounds has been examined using stationary and rotating Cu electrodes. The results show that Cr͑VI͒ is a highly efficient inhibitor not matched by comparable concentrations of Ce͑III͒ in its effect. Results suggest ͑i͒ bulk reduction of Cr͑VI͒ to a three-dimensional inhibiting film is not necessary to explain the role of Cr͑VI͒; ͑ii͒ Cr͑VI͒ inhibition of oxygen reduction on Cu is irreversible as shown previousl… Show more

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Cited by 82 publications
(58 citation statements)
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“…20,48,[50][51][52] To obtain Ce(IV) in aqueous solution, however, requires a strong oxidizing agent such as hydrogen peroxide.…”
Section: Anodic Hardening Processmentioning
confidence: 99%
See 3 more Smart Citations
“…20,48,[50][51][52] To obtain Ce(IV) in aqueous solution, however, requires a strong oxidizing agent such as hydrogen peroxide.…”
Section: Anodic Hardening Processmentioning
confidence: 99%
“…20,47,50,52,53 For example, after simple immersion in Ce(III) the orange DCP data in Figure 37 show that the OCP of the TCP-passivated AA2024-T3 alloy shifts to lower potential, which implies a strong cathodic inhibition effect that is related to passivation of the intermetallic inclusions on the alloy surface. 19,45,47 Typically Cu-rich inclusions provide cathodic sites for proton reduction reaction due to its galvanic effect.…”
Section: In Situ Nr Of Ce(iii) Cathodic Hardeningmentioning
confidence: 99%
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“…It is generally believed that corrosion inhibitors effectively eliminate the undesirable destructive effects of aggressive media and prevent copper dissolution. Organic compounds containing polar groups including nitrogen, sulphur, and oxygen [15][16][17] and heterocyclic compounds with polar functional groups and/or conjugated double bonds [18][19] have been reported to inhibit copper corrosion. The inhibiting action of these compounds is usually attributed to their interactions with the copper surface via their adsorption.…”
Section: Introductionmentioning
confidence: 99%