Crack initiation at free edge of interface between thin films in advanced LSI

Kitamura, Takayuki; Shibutani, Tadahiro; Ueno, Takashi

doi:10.1016/s0013-7944(02)00009-7

Cited by 69 publications

(31 citation statements)

References 9 publications

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“…It is seen that the orders of the stress singularities range from 0.1 to 0.3 for the considered cases, which are relatively high compared with other thin films used in LSI, such as Cu/TaN and Cu/TiN (Kitamura et al 2002(Kitamura et al , 2003. Meanwhile, the singularities of the PZT 90°/Si 180°edges are stronger than that of PZT 90°/Si 90°c ases.…”

Section: Numerical Results and Discussionmentioning

confidence: 86%

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On stress singularity at the interface edge between piezoelectric thin film and elastic substrate

Shang

Kitamura

2005

Microsyst Technol

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This paper deals with the modeling aspects of the stress singularity at the interface edges between piezoelectric thin film and elastic substrate. The electroelastic problem of a transversely isotropic piezoelectric thin film attached to an elastic substrate is treated theoretically. Emphasis is placed on the investigation of the singularity in the stress field at the free edge of interface. The eigen-equation determining the order of the singularity is derived. Numerical results for two edge geometries are presented for PZT film/silicon substrate combinations. It is shown that the orders of the stress singularities range from 0.1 to 0.3 for the considered cases. Moreover, piezoelectric effects may alter the singularity order to some extent, but not significantly.

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Section: Numerical Results and Discussionmentioning

confidence: 86%

“…This model is useful to analyze the stress distribution of the sandwiched cantilever shown in Fig. 2, which is developed for measuring the interface toughness between thin films (Kitamura et al 2002;Shang et al 2005). We assume the x-z plane as the plane of analysis.…”

Section: Problem Statementmentioning

confidence: 99%

On stress singularity at the interface edge between piezoelectric thin film and elastic substrate

Shang

Kitamura

2005

Microsyst Technol

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“…To obtain more general ISSF for evaluating interface strength, several analytical techniques were applied [21][22][23][24][25][26][27][28]. One of the most used numerical modelling techniques is the finite element method, which can be used for many engineering applications conveniently [29][30][31][32][33][34][35].…”

Section: Three-dimensional Mesh-independent Technique To Obtain Issfmentioning

confidence: 99%

Intensity of singular stress field for three-dimensional butt joint to evaluate the adhesive strength

Noda

Tsuboi

Takaki

et al. 2018

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. Adhesive joints are extensively used in various manufacturing processes in different industrial sectors because of its high fatigue resistance. Different materials properties cause the singular stress field, whose intensity is depending on the adhesive joint geometry. Our previous studies show that debonding strength can be expressed as a constant value of the critical intensity of singular stress field (ISSF) by using two-dimensional butt joint models. By considering real specimen geometry, in this paper, the ISSFs on the interface outer edges of three-dimensional butt joints are analysed by varying the adhesive thicknesses. A meshindependent technique combined with three-dimensional finite element method (FEM) is shown to evaluate the ISSF. The ISSF distributions on the interface outer edges are analysed in comparison with the previous two-dimensional results. It is found that the critical ISSF considered 3D geometry is almost constant independent of the adhesive thickness.

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“…The fracture mechanics parameter (3), (4) will be valid when the process zone is sufficiently smaller than the region dominated by the singular stress field. In the models analyzed, the size of the region is about 1 nm.…”

Section: Delamination Criterion and Linear Elastic Fracture Mechanicsmentioning

confidence: 99%

“…The delamination due to the stress concentration brings about fatal malfunction in the device. The linear elastic fracture mechanics (LEFM) concept is utilized for the evaluation of the interface strength at the edge (3), (4) . The size of a singular stress region near an interface edge is dependent on the film thickness (5), (6) .…”

Section: Introductionmentioning

confidence: 99%

Applicability of Fracture Mechanics on Brittle Delamination of Nanoscale Film Edge

Kitamura

Hirakata

Satake

2004

JSME Int. J., Ser. A

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The stress concentration near the interface edge of a film/substrate, which dominates the delamination, is analyzed by molecular dynamics (MD) analysis. Here, the film thickness is on the nanoscale and the interatomic interaction is simulated by Morse-type model potentials. Three types of load are applied to the film/substrate to examine the effect of the stress-concentrated region on the delamination at the interface edge. At lower applied load, the stress distribution along the interface near the edge in the MD simulation coincides well with that obtained by linear elastic analysis (FEM: Finite Element Method). However, after the stress near the edge reaches the ideal strength of the interface, it deviates from the FEM result. The delamination crack is initiated from the free edge when the stress at y < 1 nm (y: distance from the edge) reaches the ideal interface strength. This signifies the criterion of interface toughness that the delamination is governed by the stress in the region (process zone). This also suggests the limit of applicability of linear elastic fracture mechanics on the nanoscale components.

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Crack initiation at free edge of interface between thin films in advanced LSI

Cited by 69 publications

References 9 publications

On stress singularity at the interface edge between piezoelectric thin film and elastic substrate

On stress singularity at the interface edge between piezoelectric thin film and elastic substrate

Intensity of singular stress field for three-dimensional butt joint to evaluate the adhesive strength

Applicability of Fracture Mechanics on Brittle Delamination of Nanoscale Film Edge

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