Crack mechanism in wire bonding joints

Ramminger, S.; Turkes, P.; Wachutka, G.

doi:10.1016/s0026-2714(98)00141-3

Cited by 71 publications

(26 citation statements)

References 2 publications

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“…[4][5][6][7][8][9][10][11], it can be seen that the growth rate of both Ag in Sn and Cu in Sn is bigger than other phases. That is why the phases Cu 6 Sn 5 and Ag 3 Sn are bigger than other phases.…”

Section: Evolvement Of Microstructure Of Solder Jointsmentioning

confidence: 97%

“…The reliability of SMT solder joints is now more important than before Supported by Astronautic Technology Innovation Fund because only one solder joint's failure may cause a catastrophic result and give a serious worldwide influence. However, there has been little study on the solder joints' reliability in this serious condition although a lot of papers have been done in some kinds of thermal cycle load or in some kind of vibration/shock condition or in thermal-mechanical load [1][2][3][4][5][6][7][8][9][10]. These studies, although, may give some guidance to astronautic solder joints' reliability, they are not adapted to evaluate astronautic solder joints' reliability accurately.…”

Section: Introductionmentioning

confidence: 99%

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Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Guo

Zhao

Zhu

et al. 2005

Int J Adv Manuf Technol

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Along with the development of the astronautic industry, more and more SMT solder joints have been used in missile, rocket and other important equipments where the environment of astronautic equipments is more serious and complex than that in normal conditions. In this present paper, reliability of a kind of astronautic PBGA256 assembly sample is considered under the successive-high acceleration shock condition. During the test, the thickness of InterMetal Compounds (IMCs) is considered and calculated by an equation to compare with each other. It is found that the growth rate of the phase of Cu 6 Sn 5 /Cu 3 Sn and Ag 3 Sn is larger that other phases. So in the finial micrographs the phase of Cu 6 Sn 5 /Cu 3 Sn and Ag 3 Sn is easy to observed. After 3 hours' successive-high acceleration (7g) shock, although the sample PBGA solder joints are still in good condition and have no obvious crack by SEM, in the micrograph of the solder joint there are some special phenomena that is not the same as that in normal condition or thermal fatigue load.

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Section: Evolvement Of Microstructure Of Solder Jointsmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 99%

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Guo

Zhao

Zhu

et al. 2005

Int J Adv Manuf Technol

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“…FEA modelling has been used to study wire bond failure of power electronic modules [13][14][15]. A study of the failure mechanisms in the heel region of wire bond using FEM and forming process of wire is also simulated in [16].…”

Section: Introductionmentioning

confidence: 99%

Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading

Rajaguru

Bailey

2012

International Journal of Fatigue

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“…Several aluminum wires, each 500 μm (20 mils) thick, are bundled together to handle rated currents as high as 75 A, with each wire being responsible for delivering almost 10 A when the device is operating. Wire bond reliability is extremely important here [Ramminger, et al, 1998]. …”

Section: Failure Mechanismsmentioning

confidence: 99%

“…When the model is modified to simulate thermal cycling using nonlinear fracture analysis, the model shows that the cracks stop growing after a certain amount of time because the strain energy density decreased until it can only cause elastic instead of plastic deformation. However, when the model is simulated as being active, the cracks kept growing due to the current density and the associated temperature rise [Ramminger, et al, 1998]. …”

Section: Failure Mechanismsmentioning

confidence: 99%

Advanced Thermosonic Wire Bonding Using High Frequency Ultrasonic Power: Optimization, Bondability, and Reliability

Le¹

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ADVANCED THERMOSONIC WIRE BONDING USING HIGH FREQUENCY ULTRASONIC POWER: OPTIMIZATION, BONDABILITY, AND RELIABILITY Minh-Nhat Ba Le June 2009Gold wire bonding typically uses 60 KHz ultrasonic frequency. Studies have been reported that increasing ultrasonic frequency from 60KHz to 120KHz can decrease bonding time, lower bonding temperature, and/or improve the bondability of Au metalized organic substrates. This thesis presents a systematic study of the effects of 120 KHz ultrasonic frequency on the reliability of fine pitch gold wire bonding. Two wire sizes, 25.4 and 17.8 μm in diameter (1.0 and 0.7 mil, respectively) were used. The gold wires were bonded to metalized pads over organic substrates with five different metallization. The studies were carried out using a thermosonic ball bonder that is able to easily switch from ultrasonic frequency from 60 KHz to 120 KHz by changing the ultrasonic transducer and the ultrasonic generator. Bonding parameters were optimized through design of experiment methodology for four different cases: 60 KHz with 25.4 μm wire, 60 KHz with 17.8 μm wire, 120 KHz with 25.4 μm wire, and 120 KHz with 17.8 μm wire. The integrity of wire bonds was evaluated by the wire pull and the ball bond shear tests. With the optimized bonding parameters, over 2,250 bonds were made for each frequency and wire size. The samples were then divided into three groups. The first group was subjected to temperature cycling from -55°C to +125°C with one hour per cycle for up to 1000 cycles. The second group was subject to thermal aging at 125°C for up to 1000 hours. The third group was subject to humidity at 85°C/85% relative humidity (RH) for up to 1000 hours. The bond integrity was evaluated through the wire pull and the ball shear tests immediately after bonding, and after each 150, 300, 500, and 1000 hours time interval in the reliability tests. The pull and shear data are then analyzed to compare the wire bond performance between different ultrasonic frequencies.

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Crack mechanism in wire bonding joints

Cited by 71 publications

References 2 publications

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading

Advanced Thermosonic Wire Bonding Using High Frequency Ultrasonic Power: Optimization, Bondability, and Reliability

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