“…In addition, as assembling an Ultracortex-like headset frame, our design will cost only about 10 USD (using 35 rings, 58 bridges, and 116 shields) by PLA and EVA filaments. Aside from continuous innovation for electrode and amplifier technologies [4,6,8,22,23,24,25,26,27,28,29,30,31], this study contributed to a cost-efficient, montage-customable headset assembly infrastructure for a range of applications. It is worth noting that the proposed assembly grid has the capability of inserting a variety of commercial electrodes (i.e., electrode adaptor required) and wiring them to a commercial amplifier if a direct connection is feasible (e.g., OpenBCI Ganglion/Cyton biosensing board).…”