Current understanding of the intrinsic point defects and potential extrinsic dopants in p-type Cu 2 SnSe 3 is limited, which hinders further improvement of its thermoelectric performance. Here, we show that the dominant intrinsic defects in Cu 2 SnSe 3 are Cu Sn and V Cu under different chemical conditions, respectively. The presence of V Cu will damage the hole conduction network and reduce hole mobility. Besides, we find that the substitution of Al, Ga, In, Cd, Zn, Fe, and Mn for Sn can inhibit the formation of V Cu ; introducing Cu Sn , Fe Sn , Mn Sn , and Ni Cu defects can significantly enhance electronic density of states near the Fermi level due to the contribution of 3d orbitals. Therefore, increasing the Cu content and/or introducing the above beneficial dopants appropriately are expected to cause enhancement of carrier mobility and/or thermopower of Cu 2 SnSe 3 . Furthermore, introducing