Creep and rupture behavior of Cu wire/lead-free solder-alloy joint specimen

Abstract

Creep and rupture behavior of Cu wire/lead-free solder-alloy joint specimens have been investigated using Sn-3.5% Ag and Sn-0.5% Cu alloys. A Sn-37% Pb solder alloy is also used as a reference material. The present authors have fabricated a creep-rupture testing machine for Cu wire/solder-alloy joint specimens, performed creep and rupture tests at 303 K and 403 K, analyzed the characteristics of the creep and rupture behavior, and compared these to test specimens cut from the same alloy ingots. It is also found that the rupture strength of the joint specimens is related to the rupture strength of the alloys.

Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy

“…[6][7][8] Not as much is known about the effects of cooling rate on microstructure, tensile, and creep behavior of Sn-rich solders. [9][10][11] Additionally, there appears to be a lack of consensus on the fundamental deformation mechanisms and effects of cooling rate on the tensile and creep behavior of the Sn-rich solders. 1,2,[9][10][11][12][13][14][15][16] This study presents a systematic evaluation of the effects of controlled cooling rates on creep behavior of a Sn-3.5Ag solder.…”

“…[9][10][11] Additionally, there appears to be a lack of consensus on the fundamental deformation mechanisms and effects of cooling rate on the tensile and creep behavior of the Sn-rich solders. 1,2,[9][10][11][12][13][14][15][16] This study presents a systematic evaluation of the effects of controlled cooling rates on creep behavior of a Sn-3.5Ag solder. A large portion of this study was directed to the understanding of the effects of cooling rate on the creep behavior of the solder, as well as to explaining the fundamental deformation mechanisms taking place during creep.…”

Creep-Fatigue Crack Growth in Sn-3.0Ag-0.5Cu Solder

“…Many studies were performed on creep-fatigue lives (4)(13)- (16) and creep rupture lifetimes (10) (17)- (22) of solders but these studies only discussed the lifetime of bulk specimens defined by the stress drop or the specimen rupture. Since main failure mode of solder joints under cyclic thermal loading is the crack growth into solder or along solder-copper interface (23) (24) , the crack growth study is essential for predicting the lifetime of solder joints (2)(3)(5)-(8) (24)- (29) .…”