Creep behavior of 90 Pb–10 Sn alloy

Balani, Kantesh; Yang, Fuqian

doi:10.1002/pssa.200306626

Cited by 15 publications

(3 citation statements)

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“…The minimum creep rate belongs to the Zn-20Sn alloy and the highest to the Zn-40Sn alloy. It is worth noting that impression creep testing of Pb-Sn alloys has shown creep rates which are remarkably higher than those of Zn-Sn alloys; 25 for example, the minimum creep rate of Pb-10Sn under a punch stress of 100 MPa at 348 K has been reported to be about 2 9 10 À3 s À1 , while the weakest Zn-40Sn alloy possesses a creep rate of 1.8 9 10 À5 s À1 under similar test condition. Unfortunately, the literature lacks any data for the impression creep of Au-Sn alloys for comparison with the results obtained for the Zn-Sn solders in this work.…”

Section: Resultsmentioning

confidence: 96%

Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders

Mahmudi

Eslami

2010

Journal of Elec Materi

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This study examines the microstructure and impression creep behavior of the high-temperature Zn-20 wt.%Sn, Zn-30 wt.%Sn, and Zn-40 wt.%Sn solders under constant punch stress in the range of 25 MPa to 300 MPa and at temperatures in the range of 298 K to 425 K. Analysis of the data showed that, for all loads and temperatures, the Zn-20Sn alloy had the lowest creep rates, and thus the highest creep resistance, among all materials tested. This is attributed to the lower volume fraction of the soft Sn-rich phase with a continuous morphology which acts as the matrix encompassing the harder Zn phase. The stress exponents and activation energies were in the range of 4.0 to 6.1 and 40.0 kJ mol À1 to 45.3 kJ mol À1 , respectively. Based on the obtained stress exponents and activation energy data, it is proposed that dislocation climb is the controlling creep mechanism. However, the observed decreasing trend of creep activation energy with stress suggests that two parallel mechanisms of lattice-diffusion-controlled and pipe-diffusion-controlled dislocation climb are competing. Dislocation climb controlled by dislocation pipe diffusion is the controlling mechanism at high stresses, whereas climb of edge dislocations is the controlling mechanism at low stresses.

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Section: Resultsmentioning

confidence: 96%

Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders

Mahmudi

Eslami

2010

Journal of Elec Materi

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“…For the creep deformation following the power-law relation between the punching stress and the impression velocity, the activation shear strain volume,˝can be calculated as [13,24] = nRT = fnRT imp (7) where is the shear stress, f is an empirical converting factor, equal to 6 or 7 [13] (6 is used here). The stress dependence of the activation shear strain volume for different electric currents at a chamber temperature of 383 K is shown in Fig.…”

Section: Activation Shear Strain Volumementioning

confidence: 99%

Effect of electric current on the creep deformation of lead

Chen

Yang

2011

Materials Science and Engineering: A

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“…The majority of published work on the impression creep behavior of soft alloys has focused on the eutectic Pb-62.8%Sn solder alloy [8][9][10]. However, other soft materials such as Pb-10%Sn [11], Sn-3.5%Ag [12][13][14], Sn-58%Bi alloy [15], Sn-0.7%Cu and Sn-9%Zn [12] and more recently Sn-40%Pb-2.5%Sb [16] have also been studied by impression testing techniques. On the other hand, the creep behavior of lead-antimony alloys is mostly studied by room temperature indentation creep tests [17][18][19] and in some cases by high temperature conventional creep tests [20,21].…”

Section: Introductionmentioning

confidence: 99%