Creep behaviour of UF bonded MDF

Boehme, C.

doi:10.1007/bf02663258

Cited by 6 publications

(1 citation statement)

References 5 publications

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“…In addition to environmental factors, wood-based panels during services are exposed to short-term, long-term and periodical loading, the stress of which arising from loading leads to deflection in fibre products, reduces internal bond and bending strength (Boehme 1992), breaking the adhesive bonding and creating micro-fractures (Halligan & Schniewind 1972; Zhou et al 2001; Vun et al 2005). On the other hand, hydrolytic degradation in conjunction with stresses arising from swelling and load breaks covalent bonds in the adhesive that leads to appreciable deformation of wood composites (Zhou et al 2001), which may further lead to increased FE and accelerate the RH and temperature effects on the FE.…”

Section: Introductionmentioning

confidence: 99%

Effect of relative humidity and temperature on formaldehyde emission from MDF subjected to load

Ebrahimi

Najafi

Behrooz

2017

International Wood Products Journal

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Effect of relative humidity (RH) and temperatures on formaldehyde emission (FE) from medium density fibreboard (MDF) subjected to load was investigated. For this purpose, flexural creep tests at 15 and 30% of ultimate bending loads were performed by using flexural creep equipment. The samples were exposed to loads at RH of 45, 65 and 85% and temperatures of 15°C, 23°C and 30°C for 72 hours. Subsequently, FEs of samples were measured by the flask method. The results indicated that FE in loaded samples is greater than unloaded samples. FE in all samples (unloaded and loaded) increased with increasing RH and temperature. The highest FE was observed in higher load level, higher RH and at higher temperature. Temperature was more effective than RH on FE from MDF.

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