Creep crack propagation in gold submicron films at room temperature

Hirakata, Hideki; Kameyama, Takumi; Kotoge, Ryota; Kondo, Toshiyuki; Sakihara, Masayuki; Minoshima, Kohji

doi:10.1007/s10704-016-0104-z

Cited by 6 publications

(2 citation statements)

References 18 publications

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“…The small-scale creep results were used also for fracture other than high temperature strength 52), 53) .…”

Section: Discussionmentioning

confidence: 99%

A Study on Small-Scale Creep near a Crack Tip at High Temperatures

Kubo

2021

J. Soc. Mat. Sci., Japan

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This article introduces a paper on the small-scale creep effect in creep crack initiation and growth. The paper was published in the Journal of Society of Materials Science, Japan. Although it is written in Japanese, it is worldly well-known in the research area of high temperature fracture mechanics, because of its simple and useful equation describing the small-scale creep condition. The derivation of the equation is described below, together with the states of the arts in creep crack research, and the episodes about the paper. Due to recent severe economical and environmental requirements for plants and their components operated at high temperatures, their operating temperatures have increased considerably. Many of the plants and their components are then operated in the creep range where creep deformation is significant, and are also subjected to non-steady loads. To＋

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“…The small-scale creep results were used also for fracture other than high temperature strength 52), 53) .…”

Section: Discussionmentioning

confidence: 99%

A Study on Small-Scale Creep near a Crack Tip at High Temperatures

Kubo

2021

J. Soc. Mat. Sci., Japan

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“…Relationship between apparent half crack length a' and time t of a 391-nm-thick freestanding Au film obtained by in situ FESEM creep crack propagation experiment (open symbols). a'-t relationship evaluated in ambient air (B ≈ 400 nm)7) is also displayed (solid symbols).…”

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confidence: 99%

Development of <i>In Situ</i> FESEM Fatigue/Creep Experimental Technique for Freestanding Metallic Nano-Films

Kondo

Shin

Hirakata

et al. 2016

J. Soc. Mat. Sci., Japan

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Experimental technique of in situ FESEM fatigue/creep experiments has been developed to investigate the mechanisms of fatigue/creep crack propagation in freestanding metallic nano-films. We developed an in situ FESEM fatigue/creep dual-mode testing machine which was able to conduct the fatigue or creep experiments inside the FESEM chamber. The testing machine has the capability to apply high-frequency cyclic load or constant load under load-control conditions to the freestanding metallic nano-film specimens. In situ FESEM observations of the fatigue crack propagation in 523-nm-thick freestanding copper (Cu) films confirmed that intrusions/extrusions were formed ahead of the fatigue crack tip in the lower stress intensity factor range (K), and the size of the intrusions/extrusions increased as the number of stress cycles increased. The fatigue crack then propagated preferentially through these intrusions/extrusions. In the higher K, the fatigue crack propagated in tensile fracture mode. In addition, in situ FESEM observations of the creep crack propagation in 391-nm-thick freestanding gold (Au) films confirmed that voids were formed ahead of the creep crack tip, and the crack then propagated by coalescence of the voids and the crack. These results indicate that this experimental technique is effective to clarify the mechanisms and mechanics of fatigue/creep crack propagation in freestanding nano-films.

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Creep crack propagation using phase-field model within a multi-patch isogeometric framework

Si,

Hirshikesh,

et al. 2025

Computer Methods in Applied Mechanics and Engineering

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Creep crack propagation in gold submicron films at room temperature

Cited by 6 publications

References 18 publications

A Study on Small-Scale Creep near a Crack Tip at High Temperatures

A Study on Small-Scale Creep near a Crack Tip at High Temperatures

Development of <i>In Situ</i> FESEM Fatigue/Creep Experimental Technique for Freestanding Metallic Nano-Films

Creep crack propagation using phase-field model within a multi-patch isogeometric framework

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