2004
DOI: 10.2320/matertrans.45.1266
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Creep Deformation Mechanisms in Coarse-Grained Solid Solution Mg Alloys

Abstract: Creep deformation behavior of coarse-grained Mg-Al based solid solution alloy (AZ31) was studied in a wide strain rate range of 2 Â 10 À5 $7 Â 10 À2 s À1 at temperature range of 573$673 K. Viscous glide controlled creep (VGC), dislocation climb creep (DCC) and power law breakdown (PLB) showed up in order with increasing stress as the flow rate-controlling process. From the former results for Mg-Al and MgAl-Zn alloys, the creep mechanisms of VGC and DCC in Mg and Mg alloys are confirmed. Moreover, several theor… Show more

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Cited by 42 publications
(23 citation statements)
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References 31 publications
(53 reference statements)
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“…Many researchers have suggested that the flow stress during climb-controlled dislocation creep in solid solution alloys such as Al-based alloys, [28][29][30] Cu-based alloys 31) and Mg-based alloys 32,33) is dependent on the stacking fault energy. The decrease in stacking fault energy due to the alloying in solid solution alloys usually improves the creep resistance.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…Many researchers have suggested that the flow stress during climb-controlled dislocation creep in solid solution alloys such as Al-based alloys, [28][29][30] Cu-based alloys 31) and Mg-based alloys 32,33) is dependent on the stacking fault energy. The decrease in stacking fault energy due to the alloying in solid solution alloys usually improves the creep resistance.…”
Section: Discussionmentioning
confidence: 99%
“…The decrease in stacking fault energy due to the alloying in solid solution alloys usually improves the creep resistance. [28][29][30][31][32][33] It is explained that the root of solid solution strengthening in Sn-Zn alloys is also the decrease in the stacking fault energy due to the addition of Zn.…”
Section: Discussionmentioning
confidence: 99%
“…3, two different situations are observed: Al in solution leads to a minor increase in creep resistance [77,78], even when ternary elements like Sn in MRI230D alloy shift the solute partitioning during solidification, increasing the final amount of Al in solid solution [77].…”
Section: Solid Solution Hardeningmentioning
confidence: 99%
“…Considering the obtained creep mechanism, it is possible to discuss how increasing Si content improves creep strength of these alloys. According to the literature, during climb controlled dislocation creep, high--temperature mechanical properties can be improved by decreasing of stacking fault energy, the forma- tion of particles with high thermal stability inside the grains, and forming intermetallic compounds in grain boundaries [20][21][22][23]. When the stacking fault energy is reduced, many dislocations are easily dissociated to partial dislocations with a wide stacking fault band.…”
Section: Impression Creep Testingmentioning
confidence: 99%
“…Intermetallic particles can act as barriers against the dislocations slipping inside the grains. They also can improve creep properties by hindering grain boundary sliding or preventing dislocation annihilation [20][21][22][23]. Wang et al [24] showed that stacking fault energy of Mg decreases from 99.3 to 50.5 mJ m −2 with doping 0.69 % Si.…”
Section: Impression Creep Testingmentioning
confidence: 99%