Creep in lead alloys. II

Елсукова, Т. Ф.; Bol'shanina, M. A.; Makogon, M. B.; Titova, K. F.

doi:10.1007/bf00889962

Cited by 2 publications

(4 citation statements)

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“…Adding alloy elements to solders can regulate their microstructure and improve their mechanical properties [7]. The addition of elements such as Ag, Cu, In, Sb, and Te has been shown to enhance the creep resistance of pure Pb [8,9]. Specifically, the addition of Sb to Pb results in alloy hardening through continuous precipitation, making it more resistant to impact and wear [8,9].…”

Section: Introductionmentioning

confidence: 99%

“…The addition of elements such as Ag, Cu, In, Sb, and Te has been shown to enhance the creep resistance of pure Pb [8,9]. Specifically, the addition of Sb to Pb results in alloy hardening through continuous precipitation, making it more resistant to impact and wear [8,9]. Sb addition can also improve the creep resistance of pure Sn [10].…”

Section: Introductionmentioning

confidence: 99%

“…Notably, the solder containing 0.3 wt.% Sb showed a slightly increased creep rate, suggesting that trace amounts of Sb have a limited strengthening effect on Sn, owing to their similar lattice constants, and a minor impact on the solute atmosphere[19]. Additionally, Sb contributed to an increase in the stacking fault energy of Pb, thereby facilitating dislocation glide and recovery in Pb[8,28].During creep, the processes of work hardening and recovery occur simultaneously. When these rates reach a balance, a steady-state creep stage is established[23].…”

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Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Zhao,

Chang,

et al. 2024

Materials

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SnPb solder was widely used in electronic packaging for aerospace devices due to its high reliability. However, its creep resistance is poor and can be improved by adding alloying elements. The effects of Sb content on the microstructure, tensile, and creep properties of eutectic SnPb solder were investigated. Sb addition effectively improved the mechanical properties of the SnPb solder. When Sb content exceeds 1.7 wt.%, SbSn intermetallic compounds (IMCs) occurred. And increasing the Sb content increased the tensile strength. Furthermore, Sb addition decreased the steady-state creep rate and increased the stress exponent n, suggesting that the creep resistance had been enhanced, which may be attributed to the hindrance of dislocation movement by SbSn IMCs, as well as the reduction in phase boundaries, which consequently reduced grain boundary sliding.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Zhao,

Chang,

et al. 2024

Materials

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“…Stress relaxation is a delicate item related to the exposure time and the material. For overlays like lead alloy, tin alloy, sputtered aluminum alloy, we have considered that stress relaxation occurs after few hours at high temperature in the worst case [150 -200 °C][5][6][7][8]. For this range of temperature, creep is activated for all these kinds of materials.…”

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confidence: 99%

Fatigue Analysis of Conrod Bearing

Ligier

Dutfoy

2011

SAE Technical Paper Series

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For many years, bearing suppliers use efficiently the specific pressure to evaluate the fatigue risk of conrod bearings. However, modern engines have made the bearing more sensitive to various phenomena such as the thermal expansion or the elasticity of the conrod housing. These effects modify the stresses in the bearing layers and by the way the fatigue loading. In this paper, we analyze the elastic and plastic behavior of the bearing during the engine life. We detail and provide the analytical relationships, which determine stresses in the overlay and the substrate of the bearing. Various loadings are taken into account such as the thermal loading, the hydrodynamic pressure field, the fitting loading, the free spread loading. The knowledge of the relationships helps to understand the mechanical behavior of the bearing. Particularly, it allows demonstrating that plastic flow occurs in the substrate and in the overlay during the first combustion cycles and the first thermal cycles. Residual stresses are introduced by plastic flow and modify the stress tensor in the different layers. Therefore, the two layers are subject to high cycles fatigue (H.C.F.) with combustion cycles and low cycles fatigue (L.C.F.) with thermal loading. The high cycle fatigue analysis is performed with multiaxial criteria.

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Creep in lead alloys. II

Cited by 2 publications

References 0 publications

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Fatigue Analysis of Conrod Bearing

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