Creep of lead alloys. I

Елсукова, Т. Ф.; Bol'shanina, M. A.; Makogon, M. B.; Eliseeva, M. K.

doi:10.1007/bf00890889

Cited by 1 publication

(2 citation statements)

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“…Adding alloy elements to solders can regulate their microstructure and improve their mechanical properties [7]. The addition of elements such as Ag, Cu, In, Sb, and Te has been shown to enhance the creep resistance of pure Pb [8,9]. Specifically, the addition of Sb to Pb results in alloy hardening through continuous precipitation, making it more resistant to impact and wear [8,9].…”

Section: Introductionmentioning

confidence: 99%

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Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Zhao,

Chang,

et al. 2024

Materials

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SnPb solder was widely used in electronic packaging for aerospace devices due to its high reliability. However, its creep resistance is poor and can be improved by adding alloying elements. The effects of Sb content on the microstructure, tensile, and creep properties of eutectic SnPb solder were investigated. Sb addition effectively improved the mechanical properties of the SnPb solder. When Sb content exceeds 1.7 wt.%, SbSn intermetallic compounds (IMCs) occurred. And increasing the Sb content increased the tensile strength. Furthermore, Sb addition decreased the steady-state creep rate and increased the stress exponent n, suggesting that the creep resistance had been enhanced, which may be attributed to the hindrance of dislocation movement by SbSn IMCs, as well as the reduction in phase boundaries, which consequently reduced grain boundary sliding.

show abstract

Section: Introductionmentioning

confidence: 99%

“…The addition of elements such as Ag, Cu, In, Sb, and Te has been shown to enhance the creep resistance of pure Pb [8,9]. Specifically, the addition of Sb to Pb results in alloy hardening through continuous precipitation, making it more resistant to impact and wear [8,9]. Sb addition can also improve the creep resistance of pure Sn [10].…”

Section: Introductionmentioning

confidence: 99%

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Zhao,

Chang,

et al. 2024

Materials

View full text Add to dashboard Cite

show abstract

Creep of lead alloys. I

Cited by 1 publication

References 2 publications

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

Effect of Sb Content on the Microstructure and Mechanical Properties of Eutectic SnPb Solder

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