Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation

Zheng, Yuezong; Liu, Junchen; Ji, Hongchao; Huang, Xiaomin; Xiao, Wenchao; Saad, Abdullah Aziz

doi:10.1016/j.jmrt.2024.12.091

Journal of Materials Research and Technology

2025

DOI: 10.1016/j.jmrt.2024.12.091

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation

Yuezong Zheng,

Junchen Liu,

Hongchao Ji

et al.

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Creep of Sn-0.3Ag-0.7Cu solder in electronic packaging: Experiment and simulation

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References 28 publications

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