Critical properties of nanoporous low dielectric constant films revealed by Brillouin light scattering and surface acoustic wave spectroscopy

Flannery, C.M.; Wittkowski, T.; Jung, K.; Hillebrands, B.; Baklanov, Mikhaı̈l R.

doi:10.1063/1.1478775

Cited by 64 publications

(44 citation statements)

References 10 publications

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“…This expected reduction in the dielectric constant of nanoporous systems has been experimentally demonstrated both in polymeric materials and in other systems, such as silica [121][122][123] or organosilicates [124][125][126][127][128][129]. The results concerning the latter will be described briefly below for comparison with the results obtained in polymeric materials.…”

Section: Dielectric Propertiesmentioning

confidence: 84%

“…Organosilicates are also promising materials for low-k dielectrics because of their intrinsic hydrophobic behavior and the high thermal stability of the solid matrix [124][125][126][127][128][129]. Yang and coworkers [124,125] produced poly(methyl silsesquioxane) (MSQ) nanoporous organosilicate films (thicknesses of 0.3-0.8 lm) with pore sizes between 2 and 6 nm, porosities from 30% to 50%, and k values from 2 to 1.5 (lower values than that of the solid, k s % 2.8).…”

Section: Dielectric Propertiesmentioning

confidence: 99%

See 1 more Smart Citation

Nanoporous polymeric materials: A new class of materials with enhanced properties

Notario

Pinto

Rodríguez‐Pérez

2016

Progress in Materials Science

187

125

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a b s t r a c tNanoporous polymeric materials are porous materials with pore sizes in the nanometer range (i.e., below 200 nm), processed as bulk or film materials, and from a wide set of polymers. Over the last several years, research and development on these novel materials have progressed significantly, because it is believed that the reduction of the pore size to the nanometer range could strongly influence some of the properties of porous polymers, providing unexpected and improved properties compared to conventional porous and microporous polymers and non-porous solids.In this review, the key properties of these nanoporous polymeric materials (mechanical, thermal, dielectric, optical, filtration, sensing, etc.) are analyzed. The experimental and theoretical results obtained up to date related to the structure-property relations are presented. In several sections, in order to present a more compressive approach, the trends obtained for nanoporous polymers are compared to those for metallic and ceramic nanoporous systems. Moreover, some specific characteristics of these materials, such as the consequences of the confinement of both gas and solid phases, are described. Likewise, the main production methods are briefly described. Finally, some of the potential applications of these materials are also discussed in this paper.

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Section: Dielectric Propertiesmentioning

confidence: 84%

Section: Dielectric Propertiesmentioning

confidence: 99%

Nanoporous polymeric materials: A new class of materials with enhanced properties

Notario

Pinto

Rodríguez‐Pérez

2016

Progress in Materials Science

187

125

View full text Add to dashboard Cite

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“…For low-k ILD materials, this has resulted in numerous k vs. material property trends reported in the literature. Due to the extremely reduced thermal and mechanical properties exhibited by low-k ILD materials relative to SiO 2 , k vs. Young's modulus [136][137][138][139][140][141][142][143][144][145][146][147] and thermal conductivity [223][224][225][226][227][228][229][230][231][232][233][234][235] trends have been perhaps the most frequently reported in the literature. Correlations between porosity and low-k ILD thermal and mechanical properties have also been frequently reported in the literature owing to the interdependence of k and porosity and the exponential increase in difficulty associated with integrating low-k ILD materials with increasing levels of interconnected porosity.…”

Section: Current Status Of Low-k Db/ccl/es Materials and R And Dmentioning

confidence: 99%

“…[123][124][125][126][127][128] The low-k ILD and DB material properties most focused on from this viewpoint are Young's modulus and hardness as determined by nanoindentation. 129,130 Due to limitations in spatial resolution and substrate effects that have become increasingly significant as target film thicknesses decrease below 100 nm, 9,131 a number of alternative techniques have recently attracted attention such as contact resonance-atomic force microcopy (CR-AFM) [132][133][134] and bulge testing 135,136 as well as non-contact optical techniques such as picosecond laser ultrasonics (PLU), [137][138][139][140] Brillouin light scattering (BLS), [141][142][143][144][145][146] and surface acoustic wave spectroscopy (SAWS) 146,147 . However despite the extreme emphasis on measuring Young's modulus for low-k materials, the author is unaware of any established critical thresholds for these properties in either low-k ILD or DBs.…”

Section: -122mentioning

confidence: 99%

Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

King

2014

ECS J. Solid State Sci. Technol.

133

115

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Over the past decade, the primary focus for improving the performance of nano-electronic metal interconnect structures has been to reduce the impact of resistance-capacitance (RC) delays via utilizing insulating dielectrics with ever lower values of dielectric permittivity. The integration and implementation of such low dielectric constant (i.e. low-k) materials has been fraught with numerous challenges. For intermetal and interlayer (ILD) low-k dielectrics, these challenges have been largely associated to integration with metal interconnect fabrication processes and well documented and reviewed in the literature. Although equally important, less attention has been given to other low-k dielectrics utilized in metal interconnect structures that are commonly referred to as low-k dielectric barriers (DB), etch stops (ES), and/or Cu capping layers (CCL). These materials present numerous challenges as well for integration into metal interconnect fabrication processes. However, they also have more stringent integrated functionality requirements relative to low-k ILD materials that serve only a basic purpose of electrically isolating adjacent metal lines. In this article, we review the integration challenges and associated integrated functionality requirements for low-k DB/ES/CCL materials with a focus on the current status and future direction needed for these materials to facilitate both Moore's law (i.e. More Moore) and More than Moore scaling.

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“…[5] Although previous work has demonstrated the ability to control porosity in low-k materials, [6] such control has not been shown for many of the relevant physical properties, primarily because it is challenging to measure these properties directly in nanoscale systems. [7] One class of materials with large amounts of macroscopic void space that would seem ideal for low-k layers are cellular solids. Cellular solids can be formed from ceramics with low electrical conductivity, and the fundamental mechanics of such materials have been examined extensively.…”

mentioning

confidence: 99%

Probing the Effects of Nanoscale Architecture on the Mechanical Properties of Hexagonal Silica/Polymer Composite Thin Films

Kirsch

Richman

et al. 2005

Adv. Funct. Mater.

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We examine the effects of controlling nanoscale architecture on the tensile properties of honeycomb‐structured silica/polymer composite films. The hexagonal films are produced using evaporation‐induced self‐assembly and uniaxially strained using a home‐built tensile testing apparatus. Significant differences in the yield strain, failure strain, and tensile moduli between the axes parallel and perpendicular to the film‐deposition direction are observed for the thinnest films examined and are attributed to anisotropy in the film nanostructure that is further characterized with transmission electron microscopy and atomic force microscopy. For properly oriented composites, these films have tensile moduli comparable to the Young's modulus of bulk silica but exhibit failure strains that are about an order of magnitude larger than those seen in typical bulk‐silica systems. The yielding and failure processes are explored using X‐ray diffraction and optical microscopy and are characterized by irreversible changes in the nanoscale architecture. We show that tuning the nanoscale architecture can provide control over the tensile properties of composites, allowing for materials with combinations of stiffness and elasticity unachievable in the analogous bulk systems.

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Critical properties of nanoporous low dielectric constant films revealed by Brillouin light scattering and surface acoustic wave spectroscopy

Abstract: Brillouin light scattering studies of the mechanical properties of ultrathin low-k dielectric films Observation of guided longitudinal acoustic modes and nondestructive characterization of the elastic properties of hard films/coatings AIP Conf.

Cited by 64 publications

References 10 publications

Nanoporous polymeric materials: A new class of materials with enhanced properties

Nanoporous polymeric materials: A new class of materials with enhanced properties

Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

Probing the Effects of Nanoscale Architecture on the Mechanical Properties of Hexagonal Silica/Polymer Composite Thin Films

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