Critical Variables in the Decision-Making Process for AMHS Technology Selection in Semiconductor Wafer Size Transitions: Exploratory Study

Temponi, Cecilia; Jimenez, Jesús A.; Mediavilla, Francis A. Méndez

doi:10.1109/tsm.2012.2193424

Cited by 3 publications

(1 citation statement)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In order to timely filter bad chips or die and reduce packaging costs due to the failure of chips before packaging, wafer probe test is required to check the wafer [3]. With the development of electronic packaging to miniaturization and high density, better performance of the probe is required, which means new challenges to probe testing [4,5,6].…”

Section: Introductionmentioning

confidence: 99%

The Electrical Properties of the Probe under Different Loading Frequencies

Yuan

Han

Liu

2015

AMM

View full text Add to dashboard Cite

A testing circuit of probe is designed to research the electrical properties of the probe under different loading frequencies. Sinusoidal signals of different frequencies are produced by Tektronix AFG3102 signal generator, and DSOX2022A Oscilloscope is used to measure the probe voltage,constant resistance voltage and the source voltage, so the phase between the probe voltage and constant resistance voltage can be calculated. Assumed the constant resistance is a pure resistance. Since the circuit is connected in series, so the phase between the probe voltage and the probe current can be calculated. The result reveals that the probe shows resistive when the phase between the probe voltage and the probe current is 0 ° within 200 KHz frequency. Beyond 200 KHz the phase between the probe voltage and the probe current increases to 60 ° and then declines to a steady value 40°, which shows that the probe is inductive.

show abstract

Section: Introductionmentioning

confidence: 99%