Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints

Zheng, Ruiqian; Li, Wenqian; Cheng, Mengxuan; Zheng, Hao; Zhao, Zhiyan; Wan, Guoshun; Jia, Yuxi

doi:10.1016/j.microrel.2024.115473

Microelectronics Reliability

2024

DOI: 10.1016/j.microrel.2024.115473

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Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints

Ruiqian Zheng,

Wenqian Li,

Mengxuan Cheng

et al.

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Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Li,

Wang,

Zheng

et al. 2024

Microelectronics Reliability

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Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Li,

Wang,

Zheng

et al. 2024

Microelectronics Reliability

View full text Add to dashboard Cite

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Cross-scale finite element analysis of PCBA thermal cycling based on manufacturing history for more accurate fatigue life prediction of solder joints

Cited by 1 publication

References 32 publications

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

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